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参数资料
| 型号： | WV3HG64M32EEU665D4SG |
| 厂商： | MICROSEMI CORP-PMG MICROELECTRONICS |
| 元件分类： | DRAM |
| 英文描述： | 64M X 32 DDR DRAM MODULE, 0.45 ns, ZMA200 |
| 封装： | ROHS COMPLIANT, SODIMM-200 |
| 文件页数： | 3/11页 |
| 文件大小： | 139K |
| 代理商： | WV3HG64M32EEU665D4SG |
WV3HG64M32EEU-D4
October 2006
Rev. 3
ADVANCED
11
White Electronic Designs Corporation (602) 437-1520 www.wedc.com
White Electronic Designs
Document Title
256MB – 64Mx32 DDR2 SDRAM UNBUFFERED
DRAM DIE OPTIONS:
SAMSUNG: C-Die, will move to E-Die Q2'06
MICRON: U37Y: B-Die
Revision History
Rev #
History
Release Date
Status
Rev 0
Created
3-06
Advanced
Rev 1
1.1 Added row, column, and bank address
3-23-06
Advanced
Rev 2
2.1 Correction on component used, (512Mb)
2.2 Added VCCQ update
2.3 Added "x" to part number to indicate industrial temp option
2.4 Added "x" to part numbering guide to indicate industrial
temp option
2.5 Added die rev info
5-06
Advanced
Rev 3
3.1 Updated AC title to indicate component AC specs only
10-06
Advanced
相关PDF资料 |
PDF描述 |
|---|---|
| WS512K32L-35G1UIA | 512K X 32 MULTI DEVICE SRAM MODULE, 35 ns, CQFP68 |
| WF128K32-60G2UQ5A | 128K X 32 FLASH 5V PROM MODULE, 60 ns, CQFP68 |
| WS512K32L-17G1TMA | 512K X 32 MULTI DEVICE SRAM MODULE, 17 ns, CQFP68 |
| WS512K32L-55G1UQ | 512K X 32 MULTI DEVICE SRAM MODULE, 55 ns, CQFP68 |
| WF1M32C-150G2CA | 4M X 8 FLASH 12V PROM MODULE, 150 ns, CQMA68 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| WV3HG64M32EEU-D4 | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:256MB - 64Mx32 DDR2 SDRAM UNBUFFERED |
| WV3HG64M64EEU403D4IMG | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:512MB - 64Mx64 DDR2 SDRAM UNBUFFERED, SO-DIMM |
| WV3HG64M64EEU403D4ISG | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:512MB - 64Mx64 DDR2 SDRAM UNBUFFERED, SO-DIMM |
| WV3HG64M64EEU403D4MG | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:512MB - 64Mx64 DDR2 SDRAM UNBUFFERED, SO-DIMM |
| WV3HG64M64EEU403D4SG | 制造商:WEDC 制造商全称:White Electronic Designs Corporation 功能描述:512MB - 64Mx64 DDR2 SDRAM UNBUFFERED, SO-DIMM |
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