参数资料
型号: X3C09P1-03S
厂商: Anaren
文件页数: 11/25页
文件大小: 0K
描述: COUPLER 90DEG 800-1000MHZ 3DB
标准包装: 1
系列: Xinger III®
耦合器类型: 标准
频率: 800MHz ~ 1GHz
耦合系数: 3dB
应用: AMPS,CDMA,WCDMA
插入损耗: 0.14dB
功率 - 最大: 110W
隔离: 25dB
回程损耗: 23dB
封装/外壳: 2520(6450 公制)
供应商设备封装: 4-SMD
包装: 标准包装
其它名称: 1173-1105-6
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Model X3C09P1-03S
Rev B
Power Handling
The average power handling (total input power) of a Xinger coupler is a function of:
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Internal circuit temperature.
Unit mounting interface temperature.
Unit thermal resistance
Power dissipated within the unit.
All thermal calculations are based on the following assumptions:
Maximum mounting interface temperature is 95 C.
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The unit has reached a steady state operating condition.
o
Conduction Heat Transfer through the mounting interface.
No Convection Heat Transfer.
No Radiation Heat Transfer.
The material properties are constant over the operating temperature range.
Finite element simulations are made for each unit. The simulation results are used to calculate the unit thermal
resistance. The finite element simulation requires the following inputs:
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Unit material stack-up.
Material properties.
Circuit geometry.
Mounting interface temperature.
Thermal load (dissipated power).
The classical definition for dissipated power is temperature delta ( Δ T) divided by thermal resistance (R). The
dissipated power (P dis ) can also be calculated as a function of the total input power (P in ) and the thermal insertion loss
(IL therm ):
?
= P in ? ? ? 1 ? 10 10
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P dis =
Δ T
R
?
? IL therm
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?
( W )
(1)
Power flow and nomenclature for an “X” style coupler is shown in Figure 1.
Available on Tape
and Reel for Pick and
Place Manufacturing.
USA/Canada:
Toll Free:
Europe :
(315) 432-8909
(800) 411-6596
+44 2392-232392
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