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参数资料
| 型号： | X3C09P1-03S |
| 厂商： | Anaren |
| 文件页数： | 14/25页 |
| 文件大小： | 0K |
| 描述： | COUPLER 90DEG 800-1000MHZ 3DB |
| 标准包装： | 1 |
| 系列： | Xinger III® |
| 耦合器类型： | 标准 |
| 频率： | 800MHz ~ 1GHz |
| 耦合系数： | 3dB |
| 应用： | AMPS，CDMA，WCDMA |
| 插入损耗： | 0.14dB |
| 功率 - 最大： | 110W |
| 隔离： | 25dB |
| 回程损耗： | 23dB |
| 封装/外壳： | 2520（6450 公制） |
| 供应商设备封装： | 4-SMD |
| 包装： | 标准包装 |
| 其它名称： | 1173-1105-6 |
Model X3C09P1-03S
Rev B
Mounting
In order for Xinger surface mount couplers to work
optimally, there must be 50 ? transmission lines leading
to and from all of the RF ports. Also, there must be a
very good ground plane underneath the part to ensure
proper electrical performance. If either of these two
conditions is not satisfied, electrical performance may not
meet published specifications.
Overall ground is improved if a dense population of
plated through holes connect the top and bottom ground
layers of the PCB. This minimizes ground inductance
and improves ground continuity. All of the Xinger hybrid
and directional couplers are constructed from ceramic
filled PTFE composites which possess excellent electrical
and mechanical stability having X and Y thermal
coefficient of expansion (CTE) of 17-25 ppm/ o C.
When a surface mount hybrid coupler is mounted to a
printed circuit board, the primary concerns are; ensuring
the RF pads of the device are in contact with the circuit
trace of the PCB and insuring the ground plane of neither
the component nor the PCB is in contact with the RF
signal.
Mounting Footprint
Coupler Mounting Process
The process for assembling this component is a
conventional surface mount process as shown in Figure
1. This process is conducive to both low and high volume
usage.
Figure 1: Surface Mounting Process Steps
Storage of Components: The Xinger III products are
available in either an immersion tin or tin-lead finish.
Commonly used storage procedures used to control
oxidation should be followed for these surface mount
components. The storage temperatures should be held
between 15 O C and 60 O C.
Substrate: Depending upon the particular component,
the circuit material has an x and y coefficient of thermal
expansion of between 17 and 25 ppm/°C. This coefficient
minimizes solder joint stresses due to similar expansion
rates of most commonly used board substrates such as
RF35, RO4003, FR4, polyimide and G-10 materials.
Mounting to “hard” substrates (alumina etc.) is possible
depending upon operational temperature requirements.
The solder surfaces of the coupler are all copper plated
with either an immersion tin or tin-lead exterior finish.
Solder Paste: All conventional solder paste formulations
will work well with Anaren’s Xinger III surface mount
components. Solder paste can be applied with stencils or
syringe dispensers. An example of a stenciled solder
paste deposit is shown in Figure 2. As shown in the
figure solder paste is applied to the four RF pads and the
entire ground plane underneath the body of the part.
USA/Canada:
Toll Free:
Europe:
(315) 432-8909
(800) 411-6596
+44 2392-232392
Available on Tape and
Reel for Pick and Place
Manufacturing.
相关PDF资料 |
PDF描述 |
|---|---|
| X3C09P2-03S | COUPLER 90DEG 800-1000MHZ 3DB |
| X3C09P2-30S | COUPLER 90DEG 800-1000MHZ 30DB |
| X3C19E2-20S | COUPLER 90DEG 1700-2000MHZ 20DB |
| X3C19P1-03S | COUPLER 90DEG 1700-2000MHZ 3DB |
| X3C19P2-03S | COUPLER 90DEG 1700-2000MHZ 3DB |
相关代理商/技术参数 |
参数描述 |
|---|---|
| X3C09P1-03S-CT | 制造商:Anaren Microwave 功能描述:RF HYBRID COUPLER |
| X3C09P1-03SR | 制造商:Anaren Microwave 功能描述:HYBRID COUPLER 3DB 90 DEGREE 800-1000MHZ |
| X3C09P1-03S-R | 制造商:Anaren Microwave 功能描述:RF HYBRID COUPLER |
| X3C09P1-05S | 制造商:Anaren Microwave 功能描述:DIRECTIONAL COUPLER |
| X3C09P1-05S-CT | 制造商:Anaren Microwave 功能描述:RF DIRECTIONAL COUPLER |
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