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参数资料
| 型号： | X5323S8Z |
| 厂商： | Intersil |
| 文件页数： | 3/20页 |
| 文件大小： | 0K |
| 描述： | IC CPU SUPERV 32K EE 8-SOIC |
| 标准包装： | 100 |
| 类型： | 简单复位/加电复位 |
| 监视电压数目： | 1 |
| 输出： | 开路漏极或开路集电极 |
| 复位： | 低有效 |
| 复位超时： | 最小为 100 ms |
| 电压 - 阀值： | 4.38V |
| 工作温度： | 0°C ~ 70°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-SOIC |
| 包装： | 管件 |
X5323, X5325
Ordering Information (Continued)
PART NUMBER
PART NUMBER
RESET
PART
RESET
PART
V CC RANGE
TEMP
(ACTIVE LOW)
MARKING
(ACTIVE HIGH)
MARKING
(V) V TRIP RANGE RANGE (°C)
PACKAGE
X5323V14-2.7A
X5323 VAN
X5325V14-2.7A
X5325 VAN
2.7 to 5.5
2.85 to 3.0
0 to +70
14 Ld TSSOP
X5323V14Z-2.7A
(Note)
X5323 VZAN X5325V14Z-2.7A
(Note)
X5325 VZAN
0 to +70
14 Ld TSSOP
(Pb-free)
X5323V14I-2.7A
X5323 VAP
X5325V14I-2.7A
X5325 VAP
-40 to +85
14 Ld TSSOP
X5323V14IZ-2.7A
(Note)
X5323 VZAP X5325V14IZ-2.7A
(Note)
X5325 VZAP
-40 to +85
14 Ld TSSOP
(Pb-free)
X5323P-2.7
X5323PZ-2.7 (Note)
X5323PI-2.7
X5323PIZ-2.7 (Note)
X5323S8-2.7*
X5323P F
X5323P ZF
X5323P G
X5323P ZG
X5323 F
X5325P-2.7
X5325PZ-2.7
X5325PI-2.7
X5325PIZ-2.7
X5325S8-2.7*
X5325P F
X5325P ZF
X5325P G
X5325P ZG
X5325 F
2.7 to 5.5
2.55 to 2.7
0 to +70
0 to +70
-40 to +85
-40 to +85
0 to +70
8 Ld PDIP
8 Ld PDIP** (Pb-free)
8 Ld PDIP
8 Ld PDIP** (Pb-free)
8 Ld SOIC
X5323S8Z-2.7* (Note) X5323 ZF
X5325S8Z-2.7* (Note) X5325 ZF
0 to +70
8 Ld SOIC (Pb-free)
X5323S8I-2.7*
X5323 G
X5325S8I-2.7*
X5325 G
-40 to +85
8 Ld SOIC
X5323S8IZ-2.7* (Note) X5323 ZG
X5325S8IZ-2.7* (Note) X5325 ZG
-40 to +85
8 Ld SOIC (Pb-free)
X5323V14-2.7*
X5323V14Z-2.7*
X5323 VF
X5323 VZF
X5325V14-2.7*
X5325V14Z-2.7*
X5325 VF
X5325 VZF
0 to +70
0 to +70
14 Ld TSSOP
14 Ld TSSOP
(Note)
(Note)
(Pb-free)
X5323V14I-2.7*
X5323V14IZ-2.7*
X5323 VG
X5323 VZG
X5325V14I-2.7*
X5325V14IZ-2.7*
X5325 VG
X5325 VZG
-40 to +85
-40 to +85
14 Ld TSSOP
14 Ld TSSOP
(Note)
(Note)
(Pb-free)
**Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications.
NOTE: These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and 100%
matte tin plate PLUS ANNEAL - e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations.
Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-
020.
Pinouts
X5323, X5325
(8 LD SOIC, PDIP)
TOP VIEW
X5323, X5325
(14 LD TSSOP)
TOP VIEW
CS/WDI
SO
WP
V SS
1
2
3
4
8
7
6
5
V CC
RESET/RESET
SCK
SI
CS/WDI
SO
NC
NC
NC
1
2
3
4
5
14
13
12
11
10
V CC
RESET/RESET
NC
NC
NC
3
WP
V SS
6
7
9
8
SCK
SI
FN8131.2
June 30, 2008
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相关代理商/技术参数 |
参数描述 |
|---|---|
| X5323S8Z-2.7 | 功能描述:监控电路 CPU SUP/WDT 32K SPI EE RST LW 2 7-5 5V RoHS:否 制造商:STMicroelectronics 监测电压数: 监测电压: 欠电压阈值: 过电压阈值: 输出类型:Active Low, Open Drain 人工复位:Resettable 监视器:No Watchdog 电池备用开关:No Backup 上电复位延迟（典型值）:10 s 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UDFN-6 封装:Reel |
| X5323S8Z-2.7A | 功能描述:监控电路 CPU SUP/WDT 32K SPI EE RST LW 2 7-5 5V RoHS:否 制造商:STMicroelectronics 监测电压数: 监测电压: 欠电压阈值: 过电压阈值: 输出类型:Active Low, Open Drain 人工复位:Resettable 监视器:No Watchdog 电池备用开关:No Backup 上电复位延迟（典型值）:10 s 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UDFN-6 封装:Reel |
| X5323S8Z-2.7AT1 | 功能描述:监控电路 CPU SUP/WDT 32K SPI EE RST LW 2 7-5 5V RoHS:否 制造商:STMicroelectronics 监测电压数: 监测电压: 欠电压阈值: 过电压阈值: 输出类型:Active Low, Open Drain 人工复位:Resettable 监视器:No Watchdog 电池备用开关:No Backup 上电复位延迟（典型值）:10 s 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UDFN-6 封装:Reel |
| X5323S8Z-2.7T1 | 功能描述:监控电路 WATCHDOG+VCC SUPERVI 32K SPI SERIAL EPROM RoHS:否 制造商:STMicroelectronics 监测电压数: 监测电压: 欠电压阈值: 过电压阈值: 输出类型:Active Low, Open Drain 人工复位:Resettable 监视器:No Watchdog 电池备用开关:No Backup 上电复位延迟（典型值）:10 s 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UDFN-6 封装:Reel |
| X5323S8Z-4.5A | 功能描述:监控电路 CPU SUP/WDT 32K SPI EE RST LW 5V+/-10% RoHS:否 制造商:STMicroelectronics 监测电压数: 监测电压: 欠电压阈值: 过电压阈值: 输出类型:Active Low, Open Drain 人工复位:Resettable 监视器:No Watchdog 电池备用开关:No Backup 上电复位延迟（典型值）:10 s 电源电压-最大:5.5 V 最大工作温度:+ 85 C 安装风格:SMD/SMT 封装 / 箱体:UDFN-6 封装:Reel |
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