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参数资料
| 型号： | X8R |
| 厂商： | EPCOS AG |
| 英文描述： | Multilayer ceramic capacitors Chip capacitors |
| 中文描述： | 多层陶瓷电容器贴片电容 |
| 文件页数： | 4/13页 |
| 文件大小： | 120K |
| 代理商： | X8R |
12
10/06
Multilayer ceramic capacitors
Cautions and warnings
The following should be considered in the placement process
1. Ensure correct positioning of the ceramic capacitor on the solder pad.
2. Caution when using casting, injection-molded and molding compounds and cleaning agents,
as these may damage the capacitor.
3. Support the circuit board and reduce the placement forces.
4. A board should not be straightened (manually) if it has been distorted by soldering.
5. Separate panels with a peripheral saw, or better with a milling head (no dicing or breaking).
6. Caution in the subsequent placement of heavy or leaded components (e.g. transformers or
snap-in components): danger of bending and fracture.
7. When testing, transporting, packing or incorporating the board, avoid any deformation of the
board not to damage the components.
8. Avoid the use of excessive force when plugging a connector into a device soldered onto the
board.
9. Ceramic capacitors must be soldered only by the mode (reflow or wave soldering) permissible
for them (see the chapter “Soldering directions”).
10. When soldering the most gentle solder profile feasible should be selected (heating time, peak
temperature, cooling time) in order to avoid thermal stresses and damage.
11. Ensure the correct solder meniscus height and solder quantity.
12. Ensure correct dosing of the cement quantity.
13. Ceramic capacitors with an AgPd external termination are not suited for the lead-free solder
process: they were developed only for conductive adhesion technology.
This listing does not claim to be complete, but merely reflects the experience of EPCOS AG.
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相关代理商/技术参数 |
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|---|---|
| X8SAX-B | 制造商:Supermicro Computer Inc 功能描述:7X/KP3589774 ZM26S37347 制造商:Supermicro Computer 功能描述:7X/KP3589774 ZM26S37347 |
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| X8STE-B-RW | 制造商:Supermicro Computer Inc 功能描述:- Bulk |
| X8-Z11-GC02-A | 功能描述:Zigbee/802.15.4模块 Connect port IP/Xbee RF/DiN Products RoHS:否 制造商:Digi International 频带:902 MHz to 928 MHz 视线范围: 数据速率: 灵敏度: 工作电源电压:2.4 V to 3.6 V 传输供电电流:215 mA 接收供电电流:26 mA 输出功率:250 mW 天线连接器类型:Wire 最大工作温度:+ 85 C 尺寸:32.94 mm x 22 mm x 2.03 mm |
| X9000 | 制造商:INTEL 制造商全称:Intel Corporation 功能描述:Core2 Duo Processor and Core2 Extreme Processor on 45-nm Process |
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