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参数资料
| 型号： | X8R |
| 厂商： | EPCOS AG |
| 英文描述： | Multilayer ceramic capacitors Chip capacitors |
| 中文描述： | 多层陶瓷电容器贴片电容 |
| 文件页数： | 7/13页 |
| 文件大小： | 120K |
| 代理商： | X8R |
3
10/06
Please read Cautions and warnings and
Important notes at the end of this document.
Features
■ Max. relative capacitance change up to 150
°C is ±15%
■ Non-linear capacitance change
■ High insulation resistance
■ High pulse strength
■ To AEC-Q200
Applications
■ Automotive
■ Blocking
■ Coupling
■ Decoupling
■ Interference suppression
Termination
■ For soldering: Nickel barrier terminations (Ni)
Options
■ Alternative capacitance tolerances available on request
Delivery mode
■ Cardboard and blister tape (blister tape for chip thickness
1.2 ±0.1 mm and case size 1210)
180-mm and 330-mm reel available
Electrical data
Temperature characteristic
X8R
Max. relative capacitance change
within –55
°C to +150 °C
DC/C
±15
%
Climatic category (IEC 60068-1)
55/150/56
Standard
EIA
Dielectric
Class 2
Rated voltage1)
VR
50
VDC
Test voltage
Vtest
2.5 VR/5 s
VDC
Capacitance range / E series
CR
100 pF … 150 nF (E6)
Dissipation factor (limit value)
tan
d
<25 10–3
Insulation resistance2) at + 25
°CRins
>105
M
W
Insulation resistance2) at +125
°CRins
>104
M
W
Time constant2) at + 25
°C
t
>1000
s
Time constant2) at +125
°C
t
>100
s
Operating temperature range
Top
–55 … +150
°C
Ageing3)
yes
1) Note: No operation on AC line.
2) For CR >10 nF the time constant t = C Rins is given.
3) Refer to chapter “General technical information”, “Ageing”.
Chip
X8R
Multilayer ceramic capacitors
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|---|---|
| X8SAX-B | 制造商:Supermicro Computer Inc 功能描述:7X/KP3589774 ZM26S37347 制造商:Supermicro Computer 功能描述:7X/KP3589774 ZM26S37347 |
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| X8-Z11-GC02-A | 功能描述:Zigbee/802.15.4模块 Connect port IP/Xbee RF/DiN Products RoHS:否 制造商:Digi International 频带:902 MHz to 928 MHz 视线范围: 数据速率: 灵敏度: 工作电源电压:2.4 V to 3.6 V 传输供电电流:215 mA 接收供电电流:26 mA 输出功率:250 mW 天线连接器类型:Wire 最大工作温度:+ 85 C 尺寸:32.94 mm x 22 mm x 2.03 mm |
| X9000 | 制造商:INTEL 制造商全称:Intel Corporation 功能描述:Core2 Duo Processor and Core2 Extreme Processor on 45-nm Process |
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