参数资料
型号: X9268UV24
厂商: Intersil
文件页数: 12/22页
文件大小: 0K
描述: IC XDCP DUAL 256TAP 50K 24-TSSOP
标准包装: 62
系列: XDCP™
接片: 256
电阻(欧姆): 50k
电路数: 2
温度系数: 标准值 ±300 ppm/°C
存储器类型: 非易失
接口: I²C(设备位址)
电源电压: 4.5 V ~ 5.5 V
工作温度: 0°C ~ 70°C
安装类型: 表面贴装
封装/外壳: 24-TSSOP(0.173",4.40mm 宽)
供应商设备封装: 24-TSSOP
包装: 管件
2
FN8172.4
August 29, 2006
Ordering Information
PART NUMBER
PART
MARKING
VCC LIMITS
(V)
POTENTIOMETER
ORGANIZATION (k
)
TEMP. RANGE
(°C)
PACKAGE
PKG.
DWG. #
X9268TS24
X9268TS
5 ±10%
100
0 to +70
24 Ld SOIC (300mil)
M24.3
X9268TS24Z (Note)
X9268TS Z
0 to +70
24 Ld SOIC (300mil) (Pb-free)
M24.3
X9268TS24I
X9268TS I
-40 to +85
24 Ld SOIC (300mil)
M24.3
X9268TS24IZ (Note)
X9268TS ZI
-40 to +85
24 Ld SOIC (300mil) (Pb-free)
M24.3
X9268US24
X9268US
50
0 to +70
24 Ld SOIC (300mil)
M24.3
X9268US24Z (Note)
X9268US Z
0 to +70
24 Ld SOIC (300mil) (Pb-free)
M24.3
X9268US24I
X9268US I
-40 to +85
24 Ld SOIC (300mil)
M24.3
X9268US24IZ (Note)
X9268US ZI
-40 to +85
24 Ld SOIC (300mil) (Pb-free)
M24.3
X9268TS24I-2.7
X9268TS G
2.7 to 5.5
100
-40 to +85
24 Ld SOIC (300mil)
M24.3
X9268TS24IZ-2.7 (Note) X9268TS ZG
-40 to +85
24 Ld SOIC (300mil) (Pb-Free)
M24.3
*Add "T1" suffix for tape and reel.
NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate
termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
X9268
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