参数资料
型号: XA2S100E-6FT256Q
厂商: Xilinx Inc
文件页数: 3/6页
文件大小: 0K
描述: IC FPGA SPARTAN-IIE 256FPBGA
产品变化通告: FPGA Family Discontinuation 18/Apr/2011
标准包装: 90
系列: Spartan®-IIE XA
LAB/CLB数: 600
逻辑元件/单元数: 2700
RAM 位总计: 40960
输入/输出数: 182
门数: 100000
电源电压: 1.71 V ~ 1.89 V
安装类型: 表面贴装
工作温度: -40°C ~ 125°C
封装/外壳: 256-LBGA
供应商设备封装: 256-FTBGA
Spartan-IIE 1.8V FPGA Automotive XA Product Family: Introduction and Ordering
DS106-1 (v2.0) August 9, 2013
3
Product Specification
R
— OBSOLETE — OBSOLETE — OBSOLETE — OBSOLETE —
DC Specifications
Absolute Maximum Ratings(1)
Figure 1: Basic Spartan-IIE Family FPGA Block Diagram
DLL
B
L
OC
K
RA
M
B
L
OC
K
RA
M
B
L
OC
K
RA
M
B
L
OC
K
RA
M
I/O LOGIC
DS077_01_052102
Symbol
Description
Min
Max
Units
VCCINT
Supply voltage relative to GND
–0.5
2.0
V
VCCO
Supply voltage relative to GND
–0.5
4.0
V
VREF
Input reference voltage
–0.5
4.0
V
VIN
Input voltage relative to GND(2,3)
–0.5
4.05
V
VTS
Voltage applied to 3-state output (3)
–0.5
4.0
V
TSTG
Storage temperature (ambient)
–65
+150
°C
TJ
Junction temperature
-
+135
°C
Notes:
1.
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress
ratings only, and functional operation of the device at these or any other conditions beyond those listed under Operating Conditions
is not implied. Exposure to Absolute Maximum Ratings conditions for extended periods of time may affect device reliability.
2.
VIN should not exceed VCCO by more than 3.6V over extended periods of time (e.g., longer than a day).
3.
Maximum DC overshoot must be limited to either VCCO + 0.5V or 10 mA, and undershoot must be limited to –0.5V or 10 mA,
whichever is easier to achieve. The Maximum AC conditions are as follows: The device pins may undershoot to –2.0V or overshoot
to VCCO + 2.0V, provided this over/undershoot lasts no more than 11 ns with a forcing current no greater than 100 mA.
4.
For soldering guidelines, see the Packaging Information on the Xilinx Web site.
相关PDF资料
PDF描述
93C76C-E/SN IC EEPROM 8KBIT 3MHZ 8SOIC
XA2S100E-6TQ144Q IC FPGA SPARTAN-IIE 144TQFP
XA6SLX9-3FTG256I IC FPAG SPARTAN 6 9K 256FTGBGA
24LC32A-E/SM IC EEPROM 32KBIT 400KHZ 8SOIC
XA6SLX9-3CSG225I IC FPAG SPARTAN 6 9K 225CSGBGA
相关代理商/技术参数
参数描述
XA2S100E-6TQ144I 功能描述:IC FPGA SPARTAN-IIE 144TQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-IIE XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)
XA2S100E-6TQ144Q 功能描述:IC FPGA SPARTAN-IIE 144TQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-IIE XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)
XA2S150E-6FT256I 功能描述:IC FPGA SPARTAN-IIE 256FPBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-IIE XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)
XA2S150E-6FT256Q 功能描述:IC FPGA SPARTAN-IIE 256FPBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-IIE XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)
XA2S200E-6FT256I 功能描述:IC FPGA SPARTAN-IIE 256FPBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-IIE XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)