参数资料
| 型号： | XA3S1000-4FTG256I |
| 厂商： | Xilinx Inc |
| 文件页数： | 1/8页 |
| 文件大小： | 0K |
| 描述： | IC FPGA SPARTAN-3 1M 256-FTBGA |
| 标准包装： | 1 |
| 系列： | Spartan®-3 XA |
| LAB/CLB数： | 1920 |
| 逻辑元件/单元数： | 17280 |
| RAM 位总计： | 442368 |
| 输入/输出数： | 173 |
| 门数： | 1000000 |
| 电源电压： | 1.14 V ~ 1.26 V |
| 安装类型： | 表面贴装 |
| 工作温度： | -40°C ~ 100°C |
| 封装/外壳： | 256-LBGA |
| 供应商设备封装： | 256-FTBGA |
DS314 (v1.3) June 18, 2009
Product Specification
1
2004–2009 Xilinx, Inc. XILINX, the Xilinx logo, Virtex, Spartan, ISE, and other designated brands included herein are trademarks of Xilinx in the United States and other
countries. HyperTransport is a licensed trademark of the HyperTransport Technology Consortium in the U.S. and other jurisdictions. All other trademarks are the property of their
respective owners.
Summary
The Xilinx Automotive (XA) Spartan-3 family of Field-Programmable Gate Arrays meets the needs of high-volume,
cost-sensitive automotive electronic applications. The five-member family offers densities ranging from 50,000 to 1.5 million
system gates, as shown in Table 1.
Introduction
XA devices are available in both extended-temperature
Q-grade (–40°C to +125°C TJ) and I-grade (–40°C to
+100°C TJ) and are qualified to the industry-recognized
AEC-Q100 standard.
The XA Spartan-3 family builds on the success of the earlier
XA Spartan-IIE family by increasing the amount of logic
resources, the capacity of internal RAM, the total number of
I/Os, and the overall level of performance as well as by
improving clock management functions. These Spartan-3
enhancements, combined with advanced process
technology, deliver more functionality and bandwidth per
dollar than was previously possible, setting new standards
in the programmable logic industry.
Because of their exceptionally low cost, Spartan-3 FPGAs
are ideally suited to a wide range of advanced automotive
electronics modules and systems ranging from the latest
driver assistance and infotainment systems to instrument
clusters and gateways.
The Spartan-3 family is a flexible alternative to ASICs,
ASSPs, and microcontrollers. FPGAs avoid the high initial
NREs, the lengthy development cycles, and problems with
obsolescence. Also, FPGA programmability permits design
upgrades in the field with no hardware replacement
necessary.
Features
AEC-Q100 device qualification and full PPAP
documentation support available in both extended
temperature Q-grade and I-grade
Guaranteed to meet full electrical specification over the
TJ = –40°C to +125°C temperature range
Revolutionary 90-nanometer process technology
Low cost, high-performance logic solution for
high-volume, automotive applications
Three power rails: for core (1.2V), I/Os (1.2V to
3.3V), and auxiliary purposes (2.5V)
SelectIO interface signaling
Up to 487 I/O pins
622 Mb/s data transfer rate per I/O
Eighteen single-ended signal standards
Eight differential signal standards including LVDS
Termination by Digitally Controlled Impedance
Signal swing ranging from 1.14V to 3.45V
Double Data Rate (DDR) support
Logic resources
Abundant logic cells with shift register capability
Wide multiplexers
0<BL Blue>
XA Spartan-3 Automotive FPGA Family:
Introduction and Ordering Information
DS314 (v1.3) June 18, 2009
00
Product Specification
R
Table 1: Summary of Spartan-3 FPGA Attributes
Device
System
Gates
Logic
Cells
CLB Array
(One CLB = Four Slices)
Distributed
RAM (bits1)
Block RAM
(bits1)
Dedicated
Multipliers
DCMs
Maximum
User I/O
Maximum
Differential
I/O Pairs
Rows
Columns Total CLBs
XA3S50
50K
1,728
16
12
192
12K
72K
4
2
124
56
XA3S200
200K
4,320
24
20
480
30K
216K
12
4
173
76
XA3S400
400K
8,064
32
28
896
56K
288K
16
4
264
116
XA3S1000
1M
17,280
48
40
1,920
120K
432K
24
4
333
149
XA3S1500
1.5M
29,952
64
52
3,328
208K
576K
32
4
487
221
Notes:
1.
By convention, one Kb is equivalent to 1,024 bits.
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| XA3S1000-4FTG256Q | 功能描述:IC FPGA SPARTAN-3 1M 256-FTBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3 XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27） |
| XA3S100E-4CPG132I | 功能描述:IC FPGA SPARTAN-3E 100K 132CSBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3E XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27） |
| XA3S100E-4CPG132Q | 功能描述:IC FPGA SPARTAN-3E 100K 132CSBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3E XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27） |
| XA3S100E-4TQG144I | 功能描述:IC FPGA SPARTAN-3E 100K 144-TQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3E XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27） |
| XA3S100E-4TQG144Q | 功能描述:IC FPGA SPARTAN-3E 100K 144-TQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3E XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27） |
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