参数资料
型号: XA3S1500-4FGG456I
厂商: Xilinx Inc
文件页数: 4/8页
文件大小: 0K
描述: IC FPGA SPARTAN-3 1.5M 456-FBGA
标准包装: 1
系列: Spartan®-3 XA
LAB/CLB数: 3328
逻辑元件/单元数: 29952
RAM 位总计: 589824
输入/输出数: 333
门数: 1500000
电源电压: 1.14 V ~ 1.26 V
安装类型: 表面贴装
工作温度: -40°C ~ 100°C
封装/外壳: 456-BBGA
供应商设备封装: 456-FBGA
Introduction and Ordering Information
DS314 (v1.3) June 18, 2009
Product Specification
4
R
Table 2: Signal Standards Supported by the Spartan-3 Family
Standard
Category
Description
VCCO (V)
Class
Symbol
DCI
Option
Single-Ended
GTL
Gunning Transceiver Logic
N/A
Terminated
GTL
Yes
Plus
GTLP
Yes
HSTL
High-Speed Transceiver Logic
1.5
I
HSTL_I
Yes
III
HSTL_III
Yes
1.8
I
HSTL_I_18
Yes
II
HSTL_II_18
Yes
III
HSTL_III_18
Yes
LVCMOS
Low-Voltage CMOS
1.2
N/A
LVCMOS12
No
1.5
N/A
LVCMOS15
Yes
1.8
N/A
LVCMOS18
Yes
2.5
N/A
LVCMOS25
Yes
3.3
N/A
LVCMOS33
Yes
LVTTL
Low-Voltage Transistor-Transistor Logic
3.3
N/A
LVTTL
No
PCI
Peripheral Component Interconnect
3.0
33 MHz
PCI33_3
No
SSTL
Stub Series Terminated Logic
1.8
N/A (±6.7 mA)
SSTL18_I
Yes
N/A (±13.4 mA)
SSTL18_II
No
2.5
I
SSTL2_I
Yes
II
SSTL2_II
Yes
Differential
LDT
(ULVDS)
Lightning Data Transport
(HyperTransport)
2.5
N/A
LDT_25
No
LVDS
Low-Voltage Differential Signaling
Standard
LVDS_25
Yes
Bus
BLVDS_25
No
Extended Mode
LVDSEXT_25
Yes
LVPECL
Low-Voltage Positive Emitter-Coupled
Logic
2.5
N/A
LVPECL_25
No
RSDS
Reduced-Swing Differential Signaling
2.5
N/A
RSDS_25
No
HSTL
Differential High-Speed Transceiver Logic
1.8
II
DIFF_HSTL_II_18
Yes
SSTL
Differential Stub Series Terminated Logic
2.5
II
DIFF_SSTL2_II
Yes
相关PDF资料
PDF描述
25LC320AT-E/SN IC EEPROM 32KBIT 10MHZ 8SOIC
XC3SD3400A-5FGG676C SPARTAN-3ADSP FPGA 3400K 676FBGA
25LC160BT-E/ST IC EEPROM 16KBIT 10MHZ 8TSSOP
XC3S1600E-4FGG484I IC FPGA SPARTAN-3E 1600K 484FBGA
25LC160B-E/MS IC EEPROM 16KBIT 10MHZ 8MSOP
相关代理商/技术参数
参数描述
XA3S1500-4FGG676I 功能描述:IC FPGA SPARTAN-3 1.5M 676-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3 XA 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA,FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5
XA3S1600E-4FG400I 功能描述:IC FPGA SPARTAN-3E 400FGBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3E XA 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA,FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5
XA3S1600E-4FGG400I 功能描述:IC FPGA SPARTAN-3E 1600K 400FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3E XA 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA,FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5
XA3S1600E-4FGG400Q 功能描述:IC FPGA SPARTAN-3E 1600K 400FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3E XA 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA,FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5
XA3S1600E-4FGG484I 功能描述:IC FPGA SPARTAN-3E 1600K 484FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-3E XA 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA,FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5