参数资料
| 型号： | XA3S1500-4FGG456I |
| 厂商： | Xilinx Inc |
| 文件页数： | 6/8页 |
| 文件大小： | 0K |
| 描述： | IC FPGA SPARTAN-3 1.5M 456-FBGA |
| 标准包装： | 1 |
| 系列： | Spartan®-3 XA |
| LAB/CLB数： | 3328 |
| 逻辑元件/单元数： | 29952 |
| RAM 位总计： | 589824 |
| 输入/输出数： | 333 |
| 门数： | 1500000 |
| 电源电压： | 1.14 V ~ 1.26 V |
| 安装类型： | 表面贴装 |
| 工作温度： | -40°C ~ 100°C |
| 封装/外壳： | 456-BBGA |
| 供应商设备封装： | 456-FBGA |
Introduction and Ordering Information
DS314 (v1.3) June 18, 2009
Product Specification
6
R
Ordering Information
Spartan-3 FPGAs are available in Pb-free packaging options for all device/package combinations. The Pb-free packages
include a special “G” character in the ordering code.
Table 5: Quiescent Supply Current Characteristics
Symbol
Description
Device
I-Grade
Maximum
Q-Grade
Maximum
Units
ICCINTQ
Quiescent VCCINT supply current
XA3S50
50
100
mA
XA3S200
125
200
mA
XA3S400
180
250
mA
XA3S1000
315
400
mA
XA3S1500
410
-
mA
ICCOQ
Quiescent VCCO supply current
XA3S50
12
mA
XA3S200
12
mA
XA3S400
14
mA
XA3S1000
14
mA
XA3S1500
16
-
mA
ICCAUXQ
Quiescent VCCAUX supply current
XA3S50
22
25
mA
XA3S200
33
35
mA
XA3S400
44
50
mA
XA3S1000
55
60
mA
XA3S1500
85
-
mA
Notes:
1.
The numbers in this table are based on the conditions set forth in Table 31 of DS099. Quiescent supply current is measured with all
I/O drivers in a high-impedance state and with all pull-up/pull-down resistors at the I/O pads disabled. Typical values are
characterized using devices with typical processing at ambient room temperature (TA of 25°C at VCCINT = 1.2V, VCCO = 3.3V, and
VCCAUX = 2.5V). Maximum values are the production test limits measured for each device at the maximum specified junction
temperature and at maximum voltage limits with VCCINT = 1.26V, VCCO = 3.45V, and VCCAUX = 2.625V. The FPGA is programmed
with a “blank” configuration data file (i.e., a design with no functional elements instantiated). For conditions other than those
described above, (e.g., a design including functional elements, the use of DCI standards, etc.), measured quiescent current levels
may be different than the values in the table. Use the XPower Power Estimator for more accurate estimates. See Note 2.
2.
There are two recommended ways to estimate the total power consumption (quiescent plus dynamic) for a specific design: a) The
XPower Power Estimator at http://www.xilinx.com/ise/power_tools provides quick, approximate, typical estimates, and does not
require a netlist of the design. b) XPower, part of the Xilinx ISE development software, uses the FPGA netlist as input to provide more
accurate maximum and typical estimates.
3.
The maximum numbers in this table also indicate the minimum current each power rail requires in order for the FPGA to power-on
successfully, once all three rails are supplied. If VCCINT is applied before VCCAUX, there may be temporary additional ICCINT current
Figure 2:
Spartan-3 BGA Package Marking Example for Part Number XA3S1000-4 FTG256Q
Lot Code
Date Code
XA3S1000
TM
4Q
SPARTAN
Device Type
BGA Ball A1
Package
Speed Grade
Temperature Range
R
FTG256EGQ0525
D1234567A
Mask Revision Code
Process Code
Fabrication Code
DS314-1_02_100808
相关PDF资料 |
PDF描述 |
|---|---|
| 25LC320AT-E/SN | IC EEPROM 32KBIT 10MHZ 8SOIC |
| XC3SD3400A-5FGG676C | SPARTAN-3ADSP FPGA 3400K 676FBGA |
| 25LC160BT-E/ST | IC EEPROM 16KBIT 10MHZ 8TSSOP |
| XC3S1600E-4FGG484I | IC FPGA SPARTAN-3E 1600K 484FBGA |
| 25LC160B-E/MS | IC EEPROM 16KBIT 10MHZ 8MSOP |
相关代理商/技术参数 |
参数描述 |
|---|---|
| XA3S1500-4FGG676I | 功能描述:IC FPGA SPARTAN-3 1.5M 676-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3 XA 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA，FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5 |
| XA3S1600E-4FG400I | 功能描述:IC FPGA SPARTAN-3E 400FGBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3E XA 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA，FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5 |
| XA3S1600E-4FGG400I | 功能描述:IC FPGA SPARTAN-3E 1600K 400FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3E XA 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA，FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5 |
| XA3S1600E-4FGG400Q | 功能描述:IC FPGA SPARTAN-3E 1600K 400FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3E XA 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA，FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5 |
| XA3S1600E-4FGG484I | 功能描述:IC FPGA SPARTAN-3E 1600K 484FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3E XA 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA，FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5 |
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