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型号： XA3S250E-4TQG144I
厂商： Xilinx Inc
文件页数： 36/37页
文件大小： 0K
描述： IC FPGA SPARTAN-3E 250K 144-TQFP
标准包装： 60
系列： Spartan®-3E XA
LAB/CLB数： 612
逻辑元件/单元数： 5508
RAM 位总计： 221184
输入/输出数： 108
门数： 250000
电源电压： 1.14 V ~ 1.26 V
安装类型： 表面贴装
工作温度： -40°C ~ 100°C
封装/外壳： 144-LQFP
供应商设备封装： 144-TQFP（20x20）
DS635 (v2.0) September 9, 2009
www.xilinx.com
Product Specification
8
R
DC Specifications
General DC Characteristics for I/O Pins
Table 6: General Recommended Operating Conditions
Symbol
Description
Min
Nominal
Max
Units
TJ
Junction temperature
I-Grade
–40
25
100
° C
Q-Grade
–40
25
125
° C
VCCINT
Internal supply voltage
1.140
1.200
1.260
V
VCCO(1)
Output driver supply voltage
1.100
-
3.465
V
VCCAUX
Auxiliary supply voltage
2.375
2.500
2.625
V
ΔVCCAUX(2)
Voltage variance on VCCAUX when using a DCM
-
-10
mV/ms
VIN(3,4,5,6)
Input voltage extremes to avoid
turning on I/O protection diodes
I/O, Input-only, and
Dual-Purpose pins(3)
–0.5
–
VCCO + 0.5
V
Dedicated pins(4)
–0.5
–
VCCAUX + 0.5
V
TIN
Input signal transition time(7)
––
500
ns
Notes:
1.
This VCCO range spans the lowest and highest operating voltages for all supported I/O standards. Table 9 lists the recommended VCCO
range specific to each of the single-ended I/O standards, and Table 11 lists that specific to the differential standards.
2.
Only during DCM operation is it recommended that the rate of change of VCCAUX not exceed 10 mV/ms.
3.
Each of the User I/O and Dual-Purpose pins is associated with one of the four banks’ VCCO rails. Meeting the VIN limit ensures that the
internal diode junctions that exist between these pins and their associated VCCO and GND rails do not turn on. See Absolute Maximum
Ratings in DS312).
4.
All Dedicated pins (PROG_B, DONE, TCK, TDI, TDO, and TMS) draw power from the VCCAUX rail (2.5V). Meeting the VIN max limit ensures
that the internal diode junctions that exist between each of these pins and the VCCAUX and GND rails do not turn on.
5.
Input voltages outside the recommended range is permissible provided that the IIK input clamp diode rating is met and no more than 100 pins
exceed the range simultaneously. See Absolute Maximum Ratings in DS312).
6.
See XAPP459, "Eliminating I/O Coupling Effects when Interfacing Large-Swing Single-Ended Signals to User I/O Pins."
7.
Measured between 10% and 90% VCCO. Follow Signal Integrity recommendations.
Table 7: General DC Characteristics of User I/O, Dual-Purpose, and Dedicated Pins
Symbol
Description
Test Conditions
Min
Typ
Max
Units
IL
Leakage current at User I/O,
Input-only, Dual-Purpose, and
Dedicated pins
Driver is in a high-impedance state,
VIN = 0V or VCCO max, sample-tested
–10
–
+10
μA
IRPU(2)
Current through pull-up resistor at
User I/O, Dual-Purpose, Input-only,
and Dedicated pins
VIN = 0V, VCCO = 3.3V
–0.36
–
–1.24
mA
VIN = 0V, VCCO = 2.5V
–0.22
–
–0.80
mA
VIN = 0V, VCCO = 1.8V
–0.10
–
–0.42
mA
VIN = 0V, VCCO = 1.5V
–0.06
–
–0.27
mA
VIN = 0V, VCCO = 1.2V
–0.04
–
–0.22
mA
RPU(2)
Equivalent pull-up resistor value at
User I/O, Dual-Purpose, Input-only,
and Dedicated pins (based on IRPU
per Note 2)
VIN = 0V, VCCO = 3.0V to 3.465V
2.4
–
10.8
k
Ω
VIN = 0V, VCCO = 2.3V to 2.7V
2.7
–
11.8
k
Ω
VIN = 0V, VCCO = 1.7V to 1.9V
4.3
–
20.2
k
Ω
VIN = 0V, VCCO =1.4V to 1.6V
5.0
–
25.9
k
Ω
VIN = 0V, VCCO = 1.14V to 1.26V
5.5
–
32.0
k
Ω
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XA3S250E-4TQG144Q 功能描述:IC FPGA SPARTAN-3E 250K 144-TQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3E XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27）
XA3S250E-4VQG100I 功能描述:IC FPGA SPARTAN-3E 250K 100-VQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3E XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27）
XA3S250E-4VQG100Q 功能描述:IC FPGA SPARTAN-3E 250K 100-VQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3E XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27）
XA3S400-4FGG456I 功能描述:IC FPGA SPARTAN-3 400K 456-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3 XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27）
XA3S400-4FGG456Q 功能描述:IC FPGA SPARTAN-3 400K 456-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3 XA 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27）
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