参数资料
型号: XC0900A-03S
厂商: Anaren
文件页数: 11/24页
文件大小: 0K
描述: COUPLER 90DEG 811-1000MHZ 3DB
标准包装: 1
系列: Xinger II®
耦合器类型: 标准
频率: 811MHz ~ 1GHz
耦合系数: 3dB
应用: AMPS
插入损耗: 0.15dB
功率 - 最大: 225W
隔离: 25dB
回程损耗: 23dB
封装/外壳: 4-SMD,无引线
供应商设备封装: SMD
包装: 标准包装
其它名称: 1173-1122-6
Model XC0900A-03
Rev C
Power Handling
The average power handling (total input power) of a Xinger coupler is a function of:
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?
?
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Internal circuit temperature.
Unit mounting interface temperature.
Unit thermal resistance
Power dissipated within the unit.
All thermal calculations are based on the following assumptions:
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?
?
?
?
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The unit has reached a steady state operating condition.
Maximum mounting interface temperature is 95 o C.
Conduction Heat Transfer through the mounting interface.
No Convection Heat Transfer.
No Radiation Heat Transfer.
The material properties are constant over the operating temperature range.
Finite element simulations are made for each unit. The simulation results are used to calculate the unit thermal
resistance. The finite element simulation requires the following inputs:
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?
?
?
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Unit material stack-up.
Material properties.
Circuit geometry.
Mounting interface temperature.
Thermal load (dissipated power).
The classical definition for dissipated power is temperature delta ( Δ T) divided by thermal resistance (R). The
dissipated power (P dis ) can also be calculated as a function of the total input power (P in ) and the thermal insertion loss
(IL therm ):
?
= P in ? ? ? 1 ? 10 10
?
?
P dis =
Δ T
R
?
? IL therm
?
?
( W )
(1)
Power flow and nomenclature for an “X” style coupler is shown in Figure 1.
Available on Tape
and Reel for Pick and
Place Manufacturing.
USA/Canada:
Toll Free:
Europe :
(315) 432-8909
(800) 411-6596
+44 2392-232392
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