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| 型号： | XC1765ELVO8I |
| 厂商： | Xilinx Inc |
| 文件页数： | 4/13页 |
| 文件大小： | 0K |
| 描述： | IC PROM SER I-TEMP 3.3V 8-SOIC |
| 产品变化通告： | XC1700 PROMs,XC5200,HQ,SCD Parts Discontinuation 19/Jul/2010 Product Discontinuation 28/Jul/2010 |
| 标准包装： | 98 |
| 可编程类型： | OTP |
| 存储容量： | 65kb |
| 电源电压： | 3 V ~ 3.6 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-TSOP |
| 包装： | 管件 |
XC1700E, XC1700EL, and XC1700L Series Configuration PROMs
DS027 (v3.5) June 25, 2008
Product Specification
12
R
Marking Information
Due to the small size of the commercial serial PROM packages, the complete ordering part number cannot be marked on
the package. The XC prefix is deleted and the package code is simplified. Device marking is as follows:
Revision History
The following table shows the revision history for this document.
.
Date
Version
Revision
7/14/98
1.1
Major revisions to include the XC1704L, XC1702L, and the XQ1701L devices, packages and operating
conditions. Also revised the timing specifications under "AC Characteristics Over Operating Condition,"
9/8/98
2.0
Revised the marking information for the VQ44. Updated "DC Characteristics Over Operating Condition,"
page 7. Added references to the XC4000XLA and XC4000XV families in "Xilinx FPGAs and Compatible
12/18/98
2.1
the XC1702L and XC1704L products.
1/27/99
2.2
Changed Military ICCS.
7/8/99
2.3
Changed ICCS standby on XC1702/XC1704 from 50 μA to 300 μA.
3/30/00
3.0
Combined data sheets XC1700E and XC1700L. Added DS027, removed Military Specs. Added Virtex-
E and EM references.
07/05/00
3.1
Added 4.7K resistor to Figure 2, updated format.
09/07/04
3.2
Added "Pinout Diagrams," page 3.
Added footnote to table in "AC Characteristics Over Operating Condition When Cascading," page 10,
defining TCCE when cascading, and redrew associated timing diagram.
Notes:
1.
When marking the device number on the EL parts, an X is used in place of an EL.
2.
For XC1700E/EL only.
3.
For XC1700L only.
1701L J C
Operating Range/Processing
C= Commercial (TA = 0° to +70°C)
I = Industrial (TA = –40° to +85°C)
Package Type
P = 8-pin Plastic DIP
H = 8-pin Plastic DIP, Pb-Free
S(2) = 8-pin Plastic Small-Outline Package
O = 8-pin Plastic Small-Outline Package, Pb-Free
V = 8-pin Plastic Small-Outline Thin Package
G = 8-pin Plastic Small-Outline Thin Package, Pb-Free
S(3) = 20-pin Plastic Small-Outline Package
J = 20-pin Plastic Leaded Chip Carrier
E = 20-pin Plastic Leaded Chip Carrier, Pb-Free
VQ44 = 44-pin Plastic Quad Flat Package
PC44 = 44-pin Plastic Chip Carrier
Device Number
1736E
1765E
1765X(1)
17128E
17128X(1)
17256E
17256X(1)
1704L
1702L
1701
1701L
17512L
Product Obsolete or Under Obsolescence
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相关代理商/技术参数 |
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| XC1765ELVOG8C | 功能描述:IC 3V SER CFG PROM 65K 8-SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 - 用于 FPGA 的配置 Proms 系列:- 产品变化通告:Product Discontinuation 28/Jul/2010 标准包装:98 系列:- 可编程类型:OTP 存储容量:300kb 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-TSOP 包装:管件 |
| XC1765EPC20C | 功能描述:IC PROM SER C-TEMP 3.3V 20-PLCC RoHS:否 类别:集成电路 (IC) >> 存储器 - 用于 FPGA 的配置 Proms 系列:- 产品变化通告:Product Discontinuation 28/Jul/2010 标准包装:98 系列:- 可编程类型:OTP 存储容量:300kb 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-TSOP 包装:管件 |
| XC1765EPC20I | 功能描述:IC PROM SER I-TEMP 3.3V 20-PLCC RoHS:否 类别:集成电路 (IC) >> 存储器 - 用于 FPGA 的配置 Proms 系列:- 产品变化通告:Product Discontinuation 28/Jul/2010 标准包装:98 系列:- 可编程类型:OTP 存储容量:300kb 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-TSOP 包装:管件 |
| XC1765EPC2OC | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Configuration EPROM |
| XC1765EPC2OI | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Configuration EPROM |
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