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参数资料
| 型号： | XC17S30XLVO8I |
| 厂商： | Xilinx Inc |
| 文件页数： | 3/11页 |
| 文件大小： | 0K |
| 描述： | IC 3V PROM SER 300K 8-SOIC |
| 产品变化通告： | Product Discontinuation 28/Jul/2010 |
| 标准包装： | 98 |
| 可编程类型： | OTP |
| 存储容量： | 300kb |
| 电源电压： | 3 V ~ 3.6 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 8-SOIC（0.154"，3.90mm 宽） |
| 供应商设备封装： | 8-TSOP |
| 包装： | 管件 |
Spartan/XL Family One-Time Programmable Configuration PROMs (XC17S00/XL)
DS030 (v1.12) June 20, 2008
Product Specification
11
R
Notice of Disclaimer
THE XILINX HARDWARE FPGA AND CPLD DEVICES REFERRED TO HEREIN (“PRODUCTS”) ARE SUBJECT TO THE TERMS AND
CONDITIONS OF THE XILINX LIMITED WARRANTY WHICH CAN BE VIEWED AT http://www.xilinx.com/warranty.htm. THIS LIMITED
WARRANTY DOES NOT EXTEND TO ANY USE OF PRODUCTS IN AN APPLICATION OR ENVIRONMENT THAT IS NOT WITHIN THE
SPECIFICATIONS STATED IN THE XILINX DATA SHEET. ALL SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE.
PRODUCTS ARE NOT DESIGNED OR INTENDED TO BE FAIL-SAFE OR FOR USE IN ANY APPLICATION REQUIRING FAIL-SAFE
PERFORMANCE, SUCH AS LIFE-SUPPORT OR SAFETY DEVICES OR SYSTEMS, OR ANY OTHER APPLICATION THAT INVOKES
THE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL
APPLICATIONS”). USE OF PRODUCTS IN CRITICAL APPLICATIONS IS AT THE SOLE RISK OF CUSTOMER, SUBJECT TO
APPLICABLE LAWS AND REGULATIONS.
07/09/07
1.11
Updated document format.
Left diagram under "Pinout Diagrams," page 2 updated to reflect new Lead-free packaging.
Deleted parameter T
SOL, Maximum Soldering Temperature, under "Absolute Maximum Ratings
Added note to "DC Characteristics Over Operating Condition," page 6 and corrected XC17S40 I
CCA
value.
Added Lead-free (RoHS-compliant) packages PDG8 and VOG8 to "Ordering Information," page 9.
Added new part numbers to and deleted XC17S200XL from "Spartan 3.3V Valid Ordering Combinations
Added new Lead-free package types G and H to "Marking Information," page 10.
06/20/08
1.12
Updated document template.
Updated copyright statement.
Added junction temperature to "Absolute Maximum Ratings(1)," page 6.
Added support for XC17S30SOG8I.
Added new Lead-free package type O to "Marking Information," page 10.
Product Obsolete or Under Obsolescence
相关PDF资料 |
PDF描述 |
|---|---|
| RCC18DCSN | CONN EDGECARD 36POS DIP .100 SLD |
| MAX8891EXK15+T | IC REG LDO 1.5V .15A SC70-5 |
| XC17S30XLVO8C | IC 3V PROM SER 300K 8-SOIC |
| 3-640866-6 | CONN RCPT 6POS 22AWG .156 TIN |
| GRM2165C1H202JA01D | CAP CER 2000PF 50V 5% NP0 0805 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| XC17S30XL-VO8I | 制造商: 功能描述: 制造商:undefined 功能描述: |
| XC17S30XLVOG8C | 功能描述:IC PROM SERIAL 3.3V 300K 8-SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 - 用于 FPGA 的配置 Proms 系列:- 产品变化通告:Product Discontinuation 28/Jul/2010 标准包装:98 系列:- 可编程类型:OTP 存储容量:300kb 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-TSOP 包装:管件 |
| XC17S30XLVOG8I | 功能描述:IC PROM SERIAL 3.3V 300K 8-SOIC RoHS:是 类别:集成电路 (IC) >> 存储器 - 用于 FPGA 的配置 Proms 系列:- 产品变化通告:Product Discontinuation 28/Jul/2010 标准包装:98 系列:- 可编程类型:OTP 存储容量:300kb 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-TSOP 包装:管件 |
| XC17S40 | 制造商:XILINX 制造商全称:XILINX 功能描述:Spartan and Spartan-XL Families Field Programmable Gate Arrays |
| XC17S40PD8C | 功能描述:IC PROM PROG C-TEMP 5V 8-DIP RoHS:否 类别:集成电路 (IC) >> 存储器 - 用于 FPGA 的配置 Proms 系列:- 产品变化通告:Product Discontinuation 28/Jul/2010 标准包装:98 系列:- 可编程类型:OTP 存储容量:300kb 电源电压:3 V ~ 3.6 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.154"，3.90mm 宽） 供应商设备封装:8-TSOP 包装:管件 |
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