参数资料
型号: XC2S100E-6PQG208C
厂商: Xilinx Inc
文件页数: 1/108页
文件大小: 0K
描述: IC FPGA 1.8V 600 CLB'S 208-PQFP
产品变化通告: FPGA Family Discontinuation 18/Apr/2011
标准包装: 24
系列: Spartan®-IIE
LAB/CLB数: 600
逻辑元件/单元数: 2700
RAM 位总计: 40960
输入/输出数: 146
门数: 100000
电源电压: 1.71 V ~ 1.89 V
安装类型: 表面贴装
工作温度: 0°C ~ 85°C
封装/外壳: 208-BFQFP
供应商设备封装: 208-PQFP(28x28)
DS077 August 9, 2013
1
Product Specification
2001–2013 Xilinx, Inc. All rights reserved. XILINX, the Xilinx logo, the Brand Window, and other designated brands included herein are trademarks of Xilinx, Inc. All other
trademarks are the property of their respective owners.
— OBSOLETE — OBSOLETE — OBSOLETE — OBSOLETE —
This document includes all four modules of the Spartan-IIE FPGA data sheet.
Module 1:
Introduction
Features
General Overview
Product Availability
User I/O Chart
Ordering Information
Module 2:
Architectural Description
-
Spartan-IIE Array
-
Input/Output Block
-
Configurable Logic Block
-
Block RAM
-
Clock Distribution: Delay-Locked Loop
-
Boundary Scan
Development System
Configuration
Module 3:
DC Specifications
-
Absolute Maximum Ratings
-
Recommended Operating Conditions
-
DC Characteristics
-
Power-On Requirements
-
DC Input and Output Levels
Switching Characteristics
-Pin-to-Pin Parameters
-
IOB Switching Characteristics
-
Clock Distribution Characteristics
-
DLL Timing Parameters
-
CLB Switching Characteristics
-
Block RAM Switching Characteristics
-
TBUF Switching Characteristics
-
JTAG Switching Characteristics
-
Configuration Switching Characteristics
Module 4:
Pin Definitions
Pinout Tables
IMPORTANT NOTE: The Spartan-IIE FPGA data sheet is in four modules. Each module has its own Revision History at the
end. Use the PDF "Bookmarks" for easy navigation in this volume.
0
Spartan-IIE FPGA Family
Data Sheet
DS077 August 9, 2013
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Product Specification
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XC2S100E-6TQG144C 功能描述:IC FPGA 1.8V 600 CLB'S 144-TQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-IIE 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)