参数资料
型号: XC2S100E-6TQ144C
厂商: Xilinx Inc
文件页数: 61/108页
文件大小: 0K
描述: IC FPGA 1.8V 600 CLB'S 144-TQFP
产品变化通告: FPGA Family Discontinuation 18/Apr/2011
标准包装: 60
系列: Spartan®-IIE
LAB/CLB数: 600
逻辑元件/单元数: 2700
RAM 位总计: 40960
输入/输出数: 102
门数: 100000
电源电压: 1.71 V ~ 1.89 V
安装类型: 表面贴装
工作温度: 0°C ~ 85°C
封装/外壳: 144-LQFP
供应商设备封装: 144-TQFP(20x20)
其它名称: 122-1206
56
DS077-4 (v3.0) August 9, 2013
Product Specification
Spartan-IIE FPGA Family: Pinout Tables
R
— OBSOLETE — OBSOLETE — OBSOLETE — OBSOLETE —
Package Thermal Characteristics
Table 14 provides the thermal characteristics for the various
Spartan-II FPGA package offerings. This information is also
available using the Thermal Query tool on xilinx.com
The junction-to-case thermal resistance (
θJC) indicates the
difference between the temperature measured on the
package body (case) and the die junction temperature per
watt of power consumption. The junction-to-board (
θJB)
value similarly reports the difference between the board and
junction temperature. The junction-to-ambient (
θJA) value
reports the temperature difference between the ambient
environment and the junction temperature. The
θJA value is
reported at different air velocities, measured in linear feet
per minute (LFM). The “Still Air (0 LFM)” column shows the
θJA value in a system without a fan. The thermal resistance
drops with increasing air flow.
Table 14: Spartan-IIE Package Thermal Characteristics
Package
Device
Junction-to-Case
(
θJC)
Junction-to-
Board (
θJB)
Junction-to-Ambient (
θJA)
at Different Air Flows
Units
Still Air
(0 LFM)
250 LFM
500 LFM
750 LFM
TQ144
TQG144
XC2S50E
5.8
N/A
32.3
25.1
21.5
20.1
°C/Watt
XC2S100E
5.3
N/A
31.4
24.4
20.8
19.6
°C/Watt
PQ208
PQG208
XC2S50E
7.1
N/A
35.1
25.9
22.9
21.2
°C/Watt
XC2S100E
6.1
N/A
34.2
25.2
22.3
20.7
°C/Watt
XC2S150E
6.0
N/A
34.1
25.2
22.2
20.6
°C/Watt
XC2S200E
4.6
N/A
32.4
23.9
21.2
19.6
°C/Watt
XC2S300E
4.0
N/A
31.6
23.3
20.6
19.1
°C/Watt
FT256
FTG256
XC2S50E
7.3
17.8
27.4
21.6
20.4
20.0
°C/Watt
XC2S100E
5.8
15.1
25.0
19.5
18.2
17.8
°C/Watt
XC2S150E
5.7
14.8
24.8
19.3
18.0
17.6
°C/Watt
XC2S200E
3.9
11.4
21.9
16.6
15.2
14.7
°C/Watt
XC2S300E
3.2
10.1
20.8
15.6
14.2
13.7
°C/Watt
XC2S400E
2.5
8.8
19.7
14.5
13.2
12.6
°C/Watt
FG456
FGG456
XC2S100E
8.4
14.9
24.3
19.2
18.1
17.4
°C/Watt
XC2S150E
8.2
14.6
24.1
19.0
17.9
17.1
°C/Watt
XC2S200E
6.3
11.6
21.0
16.1
15.0
14.3
°C/Watt
XC2S300E
5.6
10.4
19.9
15.1
13.9
13.2
°C/Watt
XC2S400E
3.6
6.5
17.7
11.7
10.5
10.0
°C/Watt
XC2S600E
2.7
5.0
17.3
11.2
10.0
9.5
°C/Watt
FG676
FGG676
XC2S400E
4.1
7.9
15.6
11.1
9.8
9.2
°C/Watt
XC2S600E
3.4
6.9
14.5
9.9
8.6
7.9
°C/Watt
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XC2S100E-6TQ144C0776 制造商:Xilinx 功能描述:
XC2S100E-6TQ144I 制造商:XILINX 制造商全称:XILINX 功能描述:Spartan-IIE 1.8V FPGA Family
XC2S100E-6TQG144C 功能描述:IC FPGA 1.8V 600 CLB'S 144-TQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Spartan®-IIE 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA(27x27)
XC2S100E-6TQG144I 制造商:XILINX 制造商全称:XILINX 功能描述:Spartan-IIE FPGA
XC2S100E7FG456C 制造商:Xilinx 功能描述: