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| 型号： | XC3S700AN-4FGG484C |
| 厂商： | Xilinx Inc |
| 文件页数： | 2/2页 |
| 文件大小： | 0K |
| 描述： | IC SPARTAN-3AN FPGA 700K 484FBGA |
| 产品培训模块： | Extended Spartan 3A FPGA Family |
| 标准包装： | 60 |
| 系列： | Spartan®-3AN |
| LAB/CLB数： | 1472 |
| 逻辑元件/单元数： | 13248 |
| RAM 位总计： | 368640 |
| 输入/输出数： | 372 |
| 门数： | 700000 |
| 电源电压： | 1.14 V ~ 1.26 V |
| 安装类型： | 表面贴装 |
| 工作温度： | 0°C ~ 85°C |
| 封装/外壳： | 484-BBGA |
| 供应商设备封装： | 484-FBGA |
| 配用： | 122-1528-ND - KIT STARTER SPARTAN-3 AN |
| 其它名称： | 122-1556 |
Corporate Headquarters
Xilinx, Inc.
2100 Logic Drive
San Jose, CA 95124
Tel: 408-559-7778
Fax: 408-559-7114
Web: www.xilinx.com
Europe Headquarters
Xilinx Ireland
One Logic Drive
Citywest Business Campus
Saggart, County Dublin
Ireland
Tel: +353-1-464-0311
Fax: +353-1-464-0324
Web: www.xilinx.com
Japan
Xilinx KK
Art Village Osaki Central Tower 4F
1-2-2 Osaki, Shinagawa-ku
Tokyo 141-0032 Japan
Zip: 141-0032
Phone +81-36744-7777
Web: japan.xilinx.com
Asia Pacific Pte. Ltd.
Xilinx, Asia Pacific
No. 3 Changi Business Park Vista, #04-01
Singapore 486051
Tel: (65) 6544-8999
Fax: (65) 6789-8886
Web: www.xilinx.com
www.xilinx.com
Copyright 2OO7 Xilinx, Inc. All rights reserved. XILINX, the Xilinx Logo, and other
designated brands included herein are trademarks of Xilinx, Inc. All other trademarks
are the property of their respective owners
Printed in U.S.A. PN 2011
Industry’s first 90nm FPGA with Electronic Serial Numbering
Each FPGA includes a permanent unique Device DNA serial number and Factory Flash ID.
Designers have complete flexibility in implementing highly customized algorithms for both
authentication, as well as non-authentication responses such as limited-functionality,
time-bomb, and self-destruct. This can significantly deter reverse-engineering, cloning,
and overbuilding.
Industry’s Largest On-Chip User Flash
The new Spartan-3AN platform boasts the industry’s largest on-chip user flash with a
capacity of up to 11Mb. It provides simple and secure embedded application storage,
while also enabling advanced real-time control with fine-grained protection, lockdown
and erase features.
Widest Support for I/O Standards
The Spartan-3AN FPGA is especially suitable for display devices supporting both TMDS and
PPDS standards. With support for 26 popular single-ended and differential signaling standards
including LVDS, RSDS, SSTL3 Class I & II, full hot-swap compliance, and pre-engineered
interface IP solutions such as PCI, PCI Express, USB, Firewire, CAN, SPI, and I2C, the
Spartan-3AN platform provides an industry-leading connectivity solution.
Flexible Power-Management Modes
The “Suspend” Mode in Spartan-3AN FPGAs provides a very flexible and effective way to
preserve power. In this mode, the total FPGA power is reduced by more than 40%. The
configuration data as well as flip-flop and RAM values are also maintained. In addition, it
includes a fast wake-up mechanism and system level synchronization across time domains.
Take the Next Step
Visit our website www.xilinx.com/spartan3an or call your local sale office or distributor for
more information about Spartan-3AN FPGAs. To start your design immediately, download
your free ISE WebPACKTM design tools at www.xilinx.com/ise. To begin evaluating Spartan-3AN
FPGAs, order your hardware development board at www.xilinx.com/s3anstarter
Spartan-3AN FPGA Platform
Device
XC3S50AN
XC3S200AN
XC3S400AN
XC3S700AN
XC3S1400AN
System Gates
50K
200K
400K
700K
1400K
Logic Cells
1,584
4,032
8,064
13,248
25,344
Dedicated Multipliers
3
16
20
32
Block RAM Blocks
3
16
20
32
Block RAM Bits
54K
288K
360K
576K
Distributed RAM Bits
11K
28K
56K
92K
176K
Flash Size Bits
1M
4M
8M
16M
User Flash Bits
627K
2M
5M
11M
DCMs
2
4
8
I/O Standards
26
Max Differential I/O
50
90
142
165
227
Max Single Ended I/O
108
195
311
372
502
Package and I/O Offerings
Device
XC3S50AN
XC3S200AN
XC3S400AN
XC3S700AN
XC3S1400AN
TQ144 20 x 20 mm
108
FT256 17 x 17 mm
195
FG400 21 x 21 mm
311
FG484 23 x 23 mm
372
FG676 27 x 27 mm
502
* Spartan-3AN platform is pin compatible with Spartan-3A platform supporting platform migration
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相关代理商/技术参数 |
参数描述 |
|---|---|
| XC3S700AN-4FGG484CES | 制造商:Xilinx 功能描述: |
| XC3S700AN-4FGG484I | 功能描述:IC FPGA SPARTAN -3AN700K 484FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3AN 标准包装:24 系列:ECP2 LAB/CLB数:1500 逻辑元件/单元数:12000 RAM 位总计:226304 输入/输出数:131 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:208-BFQFP 供应商设备封装:208-PQFP（28x28） |
| XC3S700AN-5FG484C | 制造商:Xilinx 功能描述:FPGA SPARTAN-3AN FAMILY 700K GATES 13248 CELLS 770MHZ 90NM T - Trays 制造商:Xilinx 功能描述:IC FPGA 372 I/O 484FBGA |
| XC3S700AN-5FGG484C | 功能描述:IC FPGA SPARTAN-3A 700K 484-FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3AN 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27） |
| XC3SD1800A-4CS484C | 功能描述:SPARTAN-3ADSP FPGA 1800K 484CSA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3A DSP 标准包装:40 系列:Spartan® 6 LX LAB/CLB数:3411 逻辑元件/单元数:43661 RAM 位总计:2138112 输入/输出数:358 门数:- 电源电压:1.14 V ~ 1.26 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:676-BGA 供应商设备封装:676-FBGA（27x27） |
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