参数资料
| 型号： | XC3SD3400A-5CSG484C |
| 厂商： | Xilinx Inc |
| 文件页数： | 4/7页 |
| 文件大小： | 0K |
| 描述： | SPARTAN-3ADSP FPGA 3400K 484CSA |
| 产品培训模块： | Extended Spartan 3A FPGA Family |
| 标准包装： | 84 |
| 系列： | Spartan®-3A DSP |
| LAB/CLB数： | 5968 |
| 逻辑元件/单元数： | 53712 |
| RAM 位总计： | 2322432 |
| 输入/输出数： | 309 |
| 门数： | 3400000 |
| 电源电压： | 1.14 V ~ 1.26 V |
| 安装类型： | 表面贴装 |
| 工作温度： | 0°C ~ 85°C |
| 封装/外壳： | 484-FBGA，CSPBGA |
| 供应商设备封装： | 484-CSPBGA |
| 配用： | 122-1532-ND - KIT DEVELOPMENT SPARTAN 3ADSP |
Extended Spartan-3A Family Overview
DS706 (v1.1) February 2, 2011
Product Specification
4
R
Package Marking
Figure 1 provides a top marking example for the Extended
Spartan-3A family in the quad-flat packages. Figure 2
shows the top marking for the Extended Spartan-3A family
in BGA packages. The markings for the BGA packages are
nearly identical to those for the quad-flat packages, except
that the marking is rotated with respect to the ball A1
indicator.
The “5C” and “4I” Speed Grade/Temperature Range part
combinations might be dual marked as “5C/4I”.
Table 2: Available User I/Os
Device
VQ100
VQG100
TQ144
TQG144
FT256
FTG256
FG320
FGG320
FG400
FGG400
CS484
CSG484
FG484
FGG484
FG676
FGG676
Body Size (mm)
14x14(1)
20x20(1)
17 x 17
19 x 19
21 x 21
19 x 19
23 x 23
27 x 27
XC3S50A/AN
68(2)
108
144
-
XC3S200A/AN
68(2)
-
195
248(2)
-
XC3S400A/AN
-
195
251(2)
311
-
XC3S700A/AN
-
161(2)
-
311(2)
-372
-
XC3S1400A/AN
-
161(2)
-
375
502
XC3SD1800A
-
----
309
-
519
XC3SD3400A
-
----
309
-
469
Notes:
1.
The footprints for the VQ/TQ packages are larger than the package body. See the package drawings
2.
These options are available only in the Spartan-3A devices, not the Spartan-3AN devices. See the data sheets for each device for Pb and
Pb-free package option availability.
X-Ref Target - Figure 1
Figure 1: Extended Spartan-3A Device QFP Package Marking Example
X-Ref Target - Figure 2
Figure 2: Extended Spartan-3A Device BGA Package Marking Example
Date Code
Mask Revision Code
Process Technology
XC3S50A
TM
TQ144AGQ0625
D1234567A
4C
SPARTAN
Device Type
Package
Speed Grade
Temperature Range
Fabrication Code
Pin P1
R
DS706_01_072508
Lot Code
Date Code
XC3S50A
TM
4C
SPARTAN
Device Type
BGA Ball A1
Package
Speed Grade
Temperature Range
R
DS706_02_072508
FT256 AGQ0625
D1234567A
Mask Revision Code
Process Code
Fabrication Code
相关PDF资料 |
PDF描述 |
|---|---|
| XC3S1600E-4FG400I | IC FPGA SPARTAN 3E 400FBGA |
| XC3S1600E-4FGG400I | IC FPGA SPARTAN-3E 1600K 400FBGA |
| XC2V250-5CSG144C | IC FPGA VIRTEX-II 250K 144-CSBGA |
| XC2V250-4CSG144I | IC FPGA VIRTEX-II 250K 144-CSBGA |
| XC6SLX45T-N3FGG484I | IC FPGA SPARTAN-6 484FBGA |
相关代理商/技术参数 |
参数描述 |
|---|---|
| XC3SD3400A-5FG676C | 功能描述:SPARTAN-3ADSP FPGA 3400K 676FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3A DSP 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA，FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5 |
| XC3SD3400A-5FGG676C | 功能描述:SPARTAN-3ADSP FPGA 3400K 676FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3A DSP 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA，FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5 |
| XC40 DO NOT USE## | 制造商:Xilinx 功能描述: |
| XC40 DO NOT USE### | 制造商:Xilinx 功能描述: |
| XC40 DO NOT USE##### | 制造商:Xilinx 功能描述: |
发布紧急采购，3分钟左右您将得到回复。