参数资料
| 型号： | XC3SD3400A-5CSG484C |
| 厂商： | Xilinx Inc |
| 文件页数： | 5/7页 |
| 文件大小： | 0K |
| 描述： | SPARTAN-3ADSP FPGA 3400K 484CSA |
| 产品培训模块： | Extended Spartan 3A FPGA Family |
| 标准包装： | 84 |
| 系列： | Spartan®-3A DSP |
| LAB/CLB数： | 5968 |
| 逻辑元件/单元数： | 53712 |
| RAM 位总计： | 2322432 |
| 输入/输出数： | 309 |
| 门数： | 3400000 |
| 电源电压： | 1.14 V ~ 1.26 V |
| 安装类型： | 表面贴装 |
| 工作温度： | 0°C ~ 85°C |
| 封装/外壳： | 484-FBGA，CSPBGA |
| 供应商设备封装： | 484-CSPBGA |
| 配用： | 122-1532-ND - KIT DEVELOPMENT SPARTAN 3ADSP |
Extended Spartan-3A Family Overview
DS706 (v1.1) February 2, 2011
Product Specification
5
R
Ordering Information
The Extended Spartan-3A family is available in both standard and Pb-free packaging options for all options of the
Spartan-3A devices and the Spartan-3A DSP devices, and for most options of the Spartan-3AN devices (see DS557,
Spartan-3AN FPGA Family: Introduction and Ordering Information for details).The Pb-free packages include a “G” character
in the ordering code (see Figure 3).
X-Ref Target - Figure 3
Figure 3: Ordering Information
XC3S50A -4 FTG256 C
Device Type
Speed Grade
Temperature Range
Package Type/Number of Pins
Example:
DS706_03_072508
Device
Speed Grade
Package Type / Number of Pins
Temperature Range (TJ)
XC3S50A/AN
–4 Standard Performance
VQ(G)100 100-pin Very Thin Quad Flat Pack (VQFP)
C
Commercial (0°C to 85°C)
XC3S200A/AN
–5 High Performance
TQ(G)144
144-pin Thin Quad Flat Pack (TQFP)
I
Industrial (–40°C to 100°C)
XC3S400A/AN
FT(G)256
256-ball Fine-Pitch Thin Ball Grid Array (FTBGA)
LI
Low Power Industrial (–40°C
to 100°C) for Spartan-3A
DSP devices (see DS610,
Spartan-3A DSP FPGA Data
Sheet)
XC3S700A/AN
FG(G)320
320-ball Fine-Pitch Ball Grid Array (FBGA)
XC3S1400A/AN
FG(G)400
400-ball Fine-Pitch Ball Grid Array (FBGA)
XC3SD1800A
CS(G)484
484-ball Chip-Scale Ball Grid Array (FBGA)
XC3SD3400A
FG(G)484
484-ball Fine-Pitch Ball Grid Array (FBGA)
FG(G)676
676-ball Fine-Pitch Ball Grid Array (FBGA)
Notes:
1.
The –5 speed grade is exclusively available in the Commercial temperature range.
相关PDF资料 |
PDF描述 |
|---|---|
| XC3S1600E-4FG400I | IC FPGA SPARTAN 3E 400FBGA |
| XC3S1600E-4FGG400I | IC FPGA SPARTAN-3E 1600K 400FBGA |
| XC2V250-5CSG144C | IC FPGA VIRTEX-II 250K 144-CSBGA |
| XC2V250-4CSG144I | IC FPGA VIRTEX-II 250K 144-CSBGA |
| XC6SLX45T-N3FGG484I | IC FPGA SPARTAN-6 484FBGA |
相关代理商/技术参数 |
参数描述 |
|---|---|
| XC3SD3400A-5FG676C | 功能描述:SPARTAN-3ADSP FPGA 3400K 676FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3A DSP 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA，FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5 |
| XC3SD3400A-5FGG676C | 功能描述:SPARTAN-3ADSP FPGA 3400K 676FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-3A DSP 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA，FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5 |
| XC40 DO NOT USE## | 制造商:Xilinx 功能描述: |
| XC40 DO NOT USE### | 制造商:Xilinx 功能描述: |
| XC40 DO NOT USE##### | 制造商:Xilinx 功能描述: |
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