参数资料
型号: XC4020XL-2BG256I
厂商: Xilinx Inc
文件页数: 53/68页
文件大小: 0K
描述: IC FPGA I-TEMP 3.3V 2SPD 256PBGA
产品变化通告: XC4000XL/E, XC9500XV, XC3100A Discontinuance 12/Apr/2010
标准包装: 1
系列: XC4000E/X
LAB/CLB数: 784
逻辑元件/单元数: 1862
RAM 位总计: 25088
输入/输出数: 205
门数: 20000
电源电压: 3 V ~ 3.6 V
安装类型: 表面贴装
工作温度: -40°C ~ 100°C
封装/外壳: 256-BBGA
供应商设备封装: 256-PBGA
R
May 14, 1999 (Version 1.6)
6-61
XC4000E and XC4000X Series Field Programmable Gate Arrays
6
Master Serial Mode
In Master Serial mode, the CCLK output of the lead FPGA
drives a Xilinx Serial PROM that feeds the FPGA DIN input.
Each rising edge of the CCLK output increments the Serial
PROM internal address counter. The next data bit is put on
the SPROM data output, connected to the FPGA DIN pin.
The lead FPGA accepts this data on the subsequent rising
CCLK edge.
The lead FPGA then presents the preamble data—and all
data that overows the lead device—on its DOUT pin.
There is an internal pipeline delay of 1.5 CCLK periods,
which means that DOUT changes on the falling CCLK
edge, and the next FPGA in the daisy chain accepts data
on the subsequent rising CCLK edge.
In the bitstream generation software, the user can specify
Fast CongRate, which, starting several bits into the rst
frame, increases the CCLK frequency by a factor of eight.
For actual timing values please refer to “Conguration
serial PROM and slaves are fast enough to support this
data rate. XC2000, XC3000/A, and XC3100A devices do
not support the Fast CongRate option.
The SPROM CE input can be driven from either LDC or
DONE. Using LDC avoids potential contention on the DIN
pin, if this pin is congured as user-I/O, but LDC is then
restricted to be a permanently High user output after con-
guration. Using DONE can also avoid contention on DIN,
provided the early DONE option is invoked.
Figure 51 on page 60 shows a full master/slave system.
The leftmost device is in Master Serial mode.
Master Serial mode is selected by a <000> on the mode
pins (M2, M1, M0).
Figure 53: Master Serial Mode Programming Switching Characteristics
Description
Symbol
Min
Max
Units
CCLK
DIN setup
1
TDSCK
20
ns
DIN hold
2
TCKDS
0ns
Notes:
1. At power-up, Vcc must rise from 2.0 V to Vcc min in less than 25 ms, otherwise delay conguration by pulling PROGRAM
Low until Vcc is valid.
2. Master Serial mode timing is based on testing in slave mode.
Serial Data In
CCLK
(Output)
Serial DOUT
(Output)
1
TDSCK
2
TCKDS
n
n + 1
n + 2
n – 3
n – 2
n – 1
n
X3223
Product Obsolete or Under Obsolescence
相关PDF资料
PDF描述
XC4010XL-3PQ208I IC FPGA I-TEMP 3.3V 3SPD 208PQFP
HSM28DRES CONN EDGECARD 56POS .156 EYELET
HMM28DRES CONN EDGECARD 56POS .156 EYELET
FMC44DRYN CONN EDGECARD 88POS DIP .100 SLD
FMC44DRYH CONN EDGECARD 88POS DIP .100 SLD
相关代理商/技术参数
参数描述
XC4020XL-2HT144C 功能描述:IC FPGA C-TEMP 3.3V 2SPD 144HQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:XC4000E/X 标准包装:1 系列:Kintex-7 LAB/CLB数:25475 逻辑元件/单元数:326080 RAM 位总计:16404480 输入/输出数:350 门数:- 电源电压:0.97 V ~ 1.03 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:900-BBGA,FCBGA 供应商设备封装:900-FCBGA(31x31) 其它名称:122-1789
XC4020XL-2HT144I 功能描述:IC FPGA I-TEMP 3.3V 2SPD 144HQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:XC4000E/X 标准包装:1 系列:Kintex-7 LAB/CLB数:25475 逻辑元件/单元数:326080 RAM 位总计:16404480 输入/输出数:350 门数:- 电源电压:0.97 V ~ 1.03 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:900-BBGA,FCBGA 供应商设备封装:900-FCBGA(31x31) 其它名称:122-1789
XC4020XL-2HT176C 功能描述:IC FPGA C 3.3V 2SPD 176HTQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:XC4000E/X 标准包装:1 系列:Kintex-7 LAB/CLB数:25475 逻辑元件/单元数:326080 RAM 位总计:16404480 输入/输出数:350 门数:- 电源电压:0.97 V ~ 1.03 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:900-BBGA,FCBGA 供应商设备封装:900-FCBGA(31x31) 其它名称:122-1789
XC4020XL-2HT176I 功能描述:IC FPGA I 3.3V 2SPD 176HTQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:XC4000E/X 标准包装:1 系列:Kintex-7 LAB/CLB数:25475 逻辑元件/单元数:326080 RAM 位总计:16404480 输入/输出数:350 门数:- 电源电压:0.97 V ~ 1.03 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:900-BBGA,FCBGA 供应商设备封装:900-FCBGA(31x31) 其它名称:122-1789
XC4020XL-2PQ160C 功能描述:IC FPGA C-TEMP 3.3V 2SPD 160PQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:XC4000E/X 标准包装:1 系列:Kintex-7 LAB/CLB数:25475 逻辑元件/单元数:326080 RAM 位总计:16404480 输入/输出数:350 门数:- 电源电压:0.97 V ~ 1.03 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:900-BBGA,FCBGA 供应商设备封装:900-FCBGA(31x31) 其它名称:122-1789