参数资料
型号: XC4044XL-3HQ160I
厂商: Xilinx Inc
文件页数: 58/68页
文件大小: 0K
描述: IC FPGA I-TEMP 3.3V 3SPD 160HQFP
产品变化通告: XC4000XL/E, XC9500XV, XC3100A Discontinuance 12/Apr/2010
标准包装: 1
系列: XC4000E/X
LAB/CLB数: 1600
逻辑元件/单元数: 3800
RAM 位总计: 51200
输入/输出数: 129
门数: 44000
电源电压: 3 V ~ 3.6 V
安装类型: 表面贴装
工作温度: -40°C ~ 100°C
封装/外壳: 160-BQFP 裸露焊盘
供应商设备封装: 160-PQFP(28x28)
R
May 14, 1999 (Version 1.6)
6-65
XC4000E and XC4000X Series Field Programmable Gate Arrays
6
Figure 57: Synchronous Peripheral Mode Programming Switching Characteristics
0
DOUT
CCLK
1
2
345
6
7
BYTE
0
BYTE
1
BYTE 0 OUT
BYTE 1 OUT
RDY/BUSY
INIT
1
0
X6096
Description
Symbol
Min
Max
Units
CCLK
INIT (High) setup time
TIC
5
s
D0 - D7 setup time
TDC
60
ns
D0 - D7 hold time
TCD
0ns
CCLK High time
TCCH
50
ns
CCLK Low time
TCCL
60
ns
CCLK Frequency
FCC
8
MHz
Notes:
1. Peripheral Synchronous mode can be considered Slave Parallel mode. An external CCLK provides timing, clocking in the
rst data byte on the second rising edge of CCLK after INIT goes High. Subsequent data bytes are clocked in on every
eighth consecutive rising edge of CCLK.
2. The RDY/BUSY line goes High for one CCLK period after data has been clocked in, although synchronous operation does
not require such a response.
3. The pin name RDY/BUSY is a misnomer. In Synchronous Peripheral mode this is really an ACKNOWLEDGE signal.
4. Note that data starts to shift out serially on the DOUT pin 0.5 CCLK periods after it was loaded in parallel. Therefore,
additional CCLK pulses are clearly required after the last byte has been loaded.
Product Obsolete or Under Obsolescence
相关PDF资料
PDF描述
IDT71V30S55TF8 IC SRAM 8KBIT 55NS 64TQFP
65801-139LF CLINCHER RECEPTACLE ASSY GOLD
FMC28DRYN CONN EDGECARD 56POS DIP .100 SLD
65801-113LF CLINCHER RECEPTACLE ASSY TIN
FMC28DRYH CONN EDGECARD 56POS DIP .100 SLD
相关代理商/技术参数
参数描述
XC4044XL-3HQ208C 功能描述:IC FPGA C-TEMP 3.3V 3SPD 208HQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:XC4000E/X 标准包装:1 系列:Kintex-7 LAB/CLB数:25475 逻辑元件/单元数:326080 RAM 位总计:16404480 输入/输出数:350 门数:- 电源电压:0.97 V ~ 1.03 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:900-BBGA,FCBGA 供应商设备封装:900-FCBGA(31x31) 其它名称:122-1789
XC4044XL-3HQ208I 功能描述:IC FPGA I-TEMP 3.3V 3SPD 208HQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:XC4000E/X 标准包装:1 系列:Kintex-7 LAB/CLB数:25475 逻辑元件/单元数:326080 RAM 位总计:16404480 输入/输出数:350 门数:- 电源电压:0.97 V ~ 1.03 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:900-BBGA,FCBGA 供应商设备封装:900-FCBGA(31x31) 其它名称:122-1789
XC4044XL-3HQ240C 功能描述:IC FPGA C-TEMP 3.3V 3SPD 240HQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:XC4000E/X 标准包装:1 系列:Kintex-7 LAB/CLB数:25475 逻辑元件/单元数:326080 RAM 位总计:16404480 输入/输出数:350 门数:- 电源电压:0.97 V ~ 1.03 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:900-BBGA,FCBGA 供应商设备封装:900-FCBGA(31x31) 其它名称:122-1789
XC4044XL-3HQ240I 功能描述:IC FPGA I-TEMP 3.3V 3SPD 240HQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:XC4000E/X 标准包装:1 系列:Kintex-7 LAB/CLB数:25475 逻辑元件/单元数:326080 RAM 位总计:16404480 输入/输出数:350 门数:- 电源电压:0.97 V ~ 1.03 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:900-BBGA,FCBGA 供应商设备封装:900-FCBGA(31x31) 其它名称:122-1789
XC4044XL-3HQ304C 功能描述:IC FPGA C-TEMP 3.3V 3SPD 304HQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:XC4000E/X 标准包装:1 系列:Kintex-7 LAB/CLB数:25475 逻辑元件/单元数:326080 RAM 位总计:16404480 输入/输出数:350 门数:- 电源电压:0.97 V ~ 1.03 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:900-BBGA,FCBGA 供应商设备封装:900-FCBGA(31x31) 其它名称:122-1789