参数资料
型号: XC5VFX70T-2FFG665C
厂商: Xilinx Inc
文件页数: 10/13页
文件大小: 0K
描述: IC FPGA VIRTEX-5FX 70K 665-FCBGA
标准包装: 1
系列: Virtex®-5 FXT
LAB/CLB数: 5600
逻辑元件/单元数: 71680
RAM 位总计: 5455872
输入/输出数: 360
电源电压: 0.95 V ~ 1.05 V
安装类型: 表面贴装
工作温度: 0°C ~ 85°C
封装/外壳: 665-BBGA,FCBGA
供应商设备封装: 665-FCBGA
配用: 568-5088-ND - BOARD DEMO DAC1408D750
DK-V5-EMBD-ML507-G-J-ND - DEV KIT V5 W/ISM & EDK JAPAN
DK-V5-EMBD-ML507-G-ND - DEV KIT V5 W/ISM & EDK
HW-V5-ML507-UNI-G-ND - EVAL PLATFORM V5 FXT
Virtex-5 Family Overview
6
DS100 (v5.0) February 6, 2009
Product Specification
R
Architectural Description
Virtex-5 FPGA Array Overview
Virtex-5 devices are user-programmable gate arrays with various configurable elements and embedded cores optimized for
high-density and high-performance system designs. Virtex-5 devices implement the following functionality:
I/O blocks provide the interface between package pins
and the internal configurable logic. Most popular and
leading-edge I/O standards are supported by
programmable I/O blocks (IOBs). The IOBs can be
connected to very flexible ChipSync logic for enhanced
source-synchronous interfacing. Source-synchronous
optimizations include per-bit deskew (on both input and
output signals), data serializers/deserializers, clock
dividers, and dedicated I/O and local clocking
resources.
Configurable Logic Blocks (CLBs), the basic logic
elements for Xilinx FPGAs, provide combinatorial and
synchronous logic as well as distributed memory and
SRL32 shift register capability. Virtex-5 FPGA CLBs
are based on real 6-input look-up table technology and
provide superior capabilities and performance
compared to previous generations of programmable
logic.
Block RAM modules provide flexible 36 Kbit true dual-
port RAM that are cascadable to form larger memory
blocks. In addition, Virtex-5 FPGA block RAMs contain
optional programmable FIFO logic for increased device
utilization. Each block RAM can also be configured as
two independent 18 Kbit true dual-port RAM blocks,
providing memory granularity for designs needing
smaller RAM blocks.
Cascadable embedded DSP48E slices with 25 x 18
two’s complement multipliers and 48-bit
adder/subtracter/accumulator provide massively
parallel DSP algorithm support. In addition, each
DSP48E slice can be used to perform bitwise logical
functions.
Clock Management Tile (CMT) blocks provide the most
flexible, highest-performance clocking for FPGAs. Each
CMT contains two Digital Clock Manager (DCM) blocks
(self-calibrating, fully digital), and one PLL block (self-
calibrating, analog) for clock distribution delay
compensation, clock multiplication/division, coarse-
/fine-grained clock phase shifting, and input clock jitter
filtering.
Additionally, LXT, SXT, TXT, and FXT devices also contain:
Integrated Endpoint blocks for PCI Express designs
providing x1, x4, or x8 PCI Express Endpoint
functionality. When used in conjunction with RocketIO
transceivers, a complete PCI Express Endpoint can be
implemented with minimal FPGA logic utilization.
10/100/1000 Mb/s Ethernet media-access control
blocks offer Ethernet capability.
LXT and SXT devices contain:
RocketIO GTP transceivers capable of running up to
3.75 Gb/s. Each GTP transceiver supports full-duplex,
clock-and-data recovery.
TXT and FXT devices contain:
GTX transceivers capable of running up to 6.5 Gb/s.
Each GTX transceiver supports full-duplex, clock-and-
data recovery.
FXT devices contain:
Embedded IBM PowerPC 440 RISC CPUs. Each
PowerPC 440 CPU is capable of running up to
550 MHz. Each PowerPC 440 CPU also has an APU
(Auxiliary Processor Unit) interface that supports
hardware acceleration, and an integrated cross-bar for
high data throughput.
The general routing matrix (GRM) provides an array of
routing switches between each internal component. Each
programmable element is tied to a switch matrix, allowing
multiple connections to the general routing matrix. The
overall programmable interconnection is hierarchical and
designed to support high-speed designs. In Virtex-5
devices, the routing connections are optimized to support
CLB interconnection in the fewest number of “hops.”
Reducing hops greatly increases post place-and-route
(PAR) design performance.
All programmable elements, including the routing
resources, are controlled by values stored in static storage
elements. These values are loaded into the FPGA during
configuration and can be reloaded to change the functions
of the programmable elements.
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相关代理商/技术参数
参数描述
XC5VFX70T-2FFG665CES 制造商:Xilinx 功能描述:
XC5VFX70T-2FFG665I 功能描述:IC FPGA VIRTEX-5FX 70K 665-FCBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Virtex®-5 FXT 产品变化通告:XC4000(E,L) Discontinuation 01/April/2002 标准包装:24 系列:XC4000E/X LAB/CLB数:100 逻辑元件/单元数:238 RAM 位总计:3200 输入/输出数:80 门数:3000 电源电压:4.5 V ~ 5.5 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:120-BCBGA 供应商设备封装:120-CPGA(34.55x34.55)
XC5VFX70T-3FF1136C 制造商:Xilinx 功能描述:IC FPGA VIRTEX5FX 30K 1136BGA 制造商:Xilinx 功能描述:IC FPGA 640 I/O 1136FCBGA
XC5VFX70T-3FF665C 制造商:Xilinx 功能描述:IC FPGA VIRTEX5FX 70K 665-FCBGA 制造商:Xilinx 功能描述:IC FPGA 360 I/O 665FCBGA
XC5VFX70T-3FFG1136C 功能描述:IC FPGA VIRTEX 5 70K 1136FFGBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Virtex®-5 FXT 产品变化通告:XC4000(E,L) Discontinuation 01/April/2002 标准包装:24 系列:XC4000E/X LAB/CLB数:100 逻辑元件/单元数:238 RAM 位总计:3200 输入/输出数:80 门数:3000 电源电压:4.5 V ~ 5.5 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:120-BCBGA 供应商设备封装:120-CPGA(34.55x34.55)