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型号： XC5VLX110-1FF1153C
厂商： Xilinx Inc
文件页数： 91/91页
文件大小： 0K
描述： IC FPGA VIRTEX-5 110K 1153FBGA
标准包装： 1
系列： Virtex®-5 LX
LAB/CLB数： 8640
逻辑元件/单元数： 110592
RAM 位总计： 4718592
输入/输出数： 800
电源电压： 0.95 V ~ 1.05 V
安装类型： 表面贴装
工作温度： 0°C ~ 85°C
封装/外壳： 1153-BBGA，FCBGA
供应商设备封装： 1153-FCBGA（35x35）
配用： 568-5088-ND - BOARD DEMO DAC1408D750
HW-V5-ML523-UNI-G-ND - EVALUATION PLATFORM VIRTEX-5
HW-AFX-FF1153-500-G-ND - BOARD DEV VIRTEX 5 FF1153
Virtex-5 FPGA Data Sheet: DC and Switching Characteristics
DS202 (v5.3) May 5, 2010
www.xilinx.com
Product Specification
91
Notice of Disclaimer
THE XILINX HARDWARE FPGA AND CPLD DEVICES REFERRED TO HEREIN ("PRODUCTS") ARE SUBJECT TO THE TERMS AND
CONDITIONS OF THE XILINX LIMITED WARRANTY WHICH CAN BE VIEWED AT http://www.xilinx.com/warranty.htm. THIS LIMITED
WARRANTY DOES NOT EXTEND TO ANY USE OF PRODUCTS IN AN APPLICATION OR ENVIRONMENT THAT IS NOT WITHIN THE
SPECIFICATIONS STATED IN THE XILINX DATA SHEET. ALL SPECIFICATIONS ARE SUBJECT TO CHANGE WITHOUT NOTICE.
PRODUCTS ARE NOT DESIGNED OR INTENDED TO BE FAIL-SAFE OR FOR USE IN ANY APPLICATION REQUIRING FAIL-SAFE
PERFORMANCE, SUCH AS LIFE-SUPPORT OR SAFETY DEVICES OR SYSTEMS, OR ANY OTHER APPLICATION THAT INVOKES
THE POTENTIAL RISKS OF DEATH, PERSONAL INJURY, OR PROPERTY OR ENVIRONMENTAL DAMAGE ("CRITICAL
APPLICATIONS"). USE OF PRODUCTS IN CRITICAL APPLICATIONS IS AT THE SOLE RISK OF CUSTOMER, SUBJECT TO
APPLICABLE LAWS AND REGULATIONS.
12/02/08
4.8
Added IIN row to Absolute Maximum Ratings in Table1, page1.
In Table 32, page 16, changed duty cycle values for TDCREF and added note 2.
Changed Conditions for TPHASE in Table32, page16 and Table 44, page 22.
In Table 35, page 18, updated RXPPMTOL values, updated note 1, and added note 2.
In Table 45, page 23, updated parameters with separate FXT and TXT values.
In Table 46, page 23, corrected units of TLLSKEW.
In Table 54, page 30, updated SX240T, FXT, and TXT speed grade designations.
In Table 55, page 31, updated SX240T and FXT rows.
In Table 58, page 37, added LVCMOS, 1.2V row.
In Table 59, page 38, corrected VMEAS value for LVCMOS, 1.2V row.
In Table 80, page 60, updated note 3 with sentence about global clock tree.
12/19/08
4.9
Updated Table 5, page 6 with power-on current values for XC5VSX240T, XC5VTX150T, XC5VTX240T,
XC5VFX100T, and XC5VFX200T devices.
01/14/09
4.10
In Table 1, page 1, changed note 2 to refer to UG112 for soldering guidelines.
In Table 54, page 30, moved speed grades for the XC5VTX150T and XC5VTX240T devices to
Production.
In Table 55, page 31, added the ISE software version for the XC5VTX150T and XC5VTX240T devices.
In Table 80, page 60, moved the reference to the duty cycle distortion note to apply to both
TDUTY_CYC_DLL and TDUTY_CYC_FX.
02/06/09
5.0
Changed document classification from Advance Product Specification to Product Specification.
In Table 1, page 1, changed VIN and added note 5.
In Table 5, page 6, removed the Max columns and added note 2 about calculating the maximum startup
current.
In Table 74, page 55, removed LX20T from second row of FOUTMAX.
04/01/09
5.1
In Table 65, page 44, changed “A – D input” to “AX – DX input” for the TDICK/TCKDI parameter.
In Table 74, page 55, prepended “±” to all speed grade values for the TOUTDUTY parameter.
06/25/09
5.2
In Table 2, page 2, added note 6.
In Table 11, page 9, changed VCCAUX to VCCO in note 1.
05/05/10
5.3
Removed DVPPIN from the examples in Figure 2 and Figure 7.
In Table 31, changed “GTPDRPCLK” to “GTP DCLK (DRP clock)” in the Description column. In Table 35,
added table note 2 about RXPPMTOL.
In Table 41, changed the maximum value of VISE to 1000 mV.
In Table 42, changed the minimum PLL frequency (FGPLLMIN) to 1.48 GHz for all three speed grades. In
Table 43, changed “GTXDRPCLK” to “GTX DCLK (DRP clock)” in the Description column. In Table 45,
removed “2 byte or 4 byte interface” from the Conditions column for TRX and TTX. In Table 47, added table
note 2 about RXPPMTOL.
In Table 51, changed the maximum value of AIDD to 13 mA.
In Table 74, updated description of TFBDELAY.
Date
Version
Revision
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XC5VLX110-1FF1153CES 制造商:Xilinx 功能描述:
XC5VLX110-1FF1153I 功能描述:IC FPGA VIRTEX-5 110K 1153FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Virtex®-5 LX 产品变化通告:XC4000(E,L) Discontinuation 01/April/2002 标准包装:24 系列:XC4000E/X LAB/CLB数:100 逻辑元件/单元数:238 RAM 位总计:3200 输入/输出数:80 门数:3000 电源电压:4.5 V ~ 5.5 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:120-BCBGA 供应商设备封装:120-CPGA（34.55x34.55）
XC5VLX110-1FF1760C 功能描述:IC FPGA VIRTEX-5 110K 1760FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Virtex®-5 LX 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA，FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5
XC5VLX110-1FF1760I 功能描述:IC FPGA VIRTEX-5 110K 1760FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Virtex®-5 LX 产品变化通告:XC4000(E,L) Discontinuation 01/April/2002 标准包装:24 系列:XC4000E/X LAB/CLB数:100 逻辑元件/单元数:238 RAM 位总计:3200 输入/输出数:80 门数:3000 电源电压:4.5 V ~ 5.5 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:120-BCBGA 供应商设备封装:120-CPGA（34.55x34.55）
XC5VLX110-1FF676C 功能描述:IC FPGA VIRTEX-5 110K 676FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Virtex®-5 LX 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA，FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5
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