参数资料
型号: XC5VLX110T-1FF1136I
厂商: Xilinx Inc
文件页数: 90/91页
文件大小: 0K
描述: IC FPGA VIRTEX-5 110K 1136FBGA
产品变化通告: Step Intro and Pkg Change 11/March/2008
标准包装: 1
系列: Virtex®-5 LXT
LAB/CLB数: 8640
逻辑元件/单元数: 110592
RAM 位总计: 5455872
输入/输出数: 640
电源电压: 0.95 V ~ 1.05 V
安装类型: 表面贴装
工作温度: -40°C ~ 100°C
封装/外壳: 1136-BBGA,FCBGA
供应商设备封装: 1136-FCBGA
配用: 568-5088-ND - BOARD DEMO DAC1408D750
HW-V5-ML523-FXT-UNI-G-J-ND - BOARD EVAL FOR VIRTEX-5
HW-V5-ML523-FXT-UNI-G-ND - BOARD EVAL FOR VIRTEX-5
122-1586-ND - BOARD EVAL FOR VIRTEX-5 ML555
HW-V5-ML523-UNI-G-ND - EVALUATION PLATFORM VIRTEX-5
HW-AFX-FF1136-500-G-ND - BOARD DEV VIRTEX 5 FF1136
Virtex-5 FPGA Data Sheet: DC and Switching Characteristics
DS202 (v5.3) May 5, 2010
Product Specification
90
03/31/08
4.0
Added XC5VFX30T, XC5VFX70T, XC5VFX100T, XC5VFX130T, XC5VFX200T devices to appropriate
tables.
Corrected MGTAVCC in Table 24, page 13.
Updated MGTRREF in Table 26, page 13.
Changed the symbol names to FGTPTX in Table 34 and FGTPRX in Table 35.
Added notes to Table 53.
Revised speed specification version to 1.59.
04/25/08
4.1
Added XC5VSX240T to appropriate tables.
Clarified maximum frequency descriptions in Table 68, page 47.
Added Maximum Readback Frequency (FRBCCK) to SelectMAP Mode Programming Switching in
Revised speed specification version to 1.60.
05/09/08
4.2
Revised some VMEAS values and added note 6 to Table58, page37. Added Figure 12, page 38 to
Output Delay Measurements. Revised some VMEAS and RREF values and added note 4 to Table 59,
Reversed the order of the setup/hold values for TPLLCCK_REL/TPLLCKC_REL in Table75, page56.
Added Package Skew values to Table 99, page 84.
05/15/08
4.3
06/12/08
4.4
Added values to some devices in Table 4.
Increased the maximum VIN in Table 28, page 14.
Revised VIDIFF and VISE in Table 29, Figure 3, and Figure 4, page 15. Same change for GTX
Added values to Table 43.
Updated Table 54 and Table 55 with production status on some devices.
In Table 71, revised TBCCK0_0, TBGCK0_0. In Table 73, revised TBRCKO_O, and TBRCKO_O_BYP.
Revised XC5VLX20T, XC5VLX155, XC5VLX155T, XC5VFX30T, XC5VFX70T, XC5VFX100T,
XC5VFX130T, and some XC5VSX240T values in Table 84 through Table 98.
06/18/08
4.5
Added values to Table 5.
06/26/08
4.6
Added values to Table 5.
Moved XC5VLX20T to production in Table 54 and Table 55.
Updated the FOUTMAX in Table 74.
09/23/08
4.7
Added XC5VTX150T and XC5VTX240T devices to appropriate tables.
Added values to Table 4 and Table 5.
Moved XC5VLX20T to production in Table 54 and Table 55.
Added note 8 to Table 68, page 47.
Added note 1 to Table 74, page 55.
Date
Version
Revision
相关PDF资料
PDF描述
XC6VHX255T-1FFG1155C IC FPGA VIRTEX 1156FCBGA
XC6VHX250T-1FFG1154C IC FPGA VIRTEX 6 251K 1156FCBGA
XC5VLX110T-2FFG1738C IC FPGA VIRTEX-5 110K 1738FBGA
XC5VLX110T-2FF1738C IC FPGA VIRTEX-5 110K 1738FBGA
XC2V4000-4FF1152I IC FPGA VIRTEX-II 1152FCBGA
相关代理商/技术参数
参数描述
XC5VLX110T-1FF1738C 功能描述:IC FPGA VIRTEX-5 110K 1738FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Virtex®-5 LXT 产品变化通告:XC4000(E,L) Discontinuation 01/April/2002 标准包装:24 系列:XC4000E/X LAB/CLB数:100 逻辑元件/单元数:238 RAM 位总计:3200 输入/输出数:80 门数:3000 电源电压:4.5 V ~ 5.5 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:120-BCBGA 供应商设备封装:120-CPGA(34.55x34.55)
XC5VLX110T-1FF1738I 功能描述:IC FPGA VIRTEX-5 110K 1738FBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Virtex®-5 LXT 产品变化通告:XC4000(E,L) Discontinuation 01/April/2002 标准包装:24 系列:XC4000E/X LAB/CLB数:100 逻辑元件/单元数:238 RAM 位总计:3200 输入/输出数:80 门数:3000 电源电压:4.5 V ~ 5.5 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:120-BCBGA 供应商设备封装:120-CPGA(34.55x34.55)
XC5VLX110T-1FFG1136C 功能描述:IC FPGA VIRTEX-5 110K 1136FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Virtex®-5 LXT 产品变化通告:XC4000(E,L) Discontinuation 01/April/2002 标准包装:24 系列:XC4000E/X LAB/CLB数:100 逻辑元件/单元数:238 RAM 位总计:3200 输入/输出数:80 门数:3000 电源电压:4.5 V ~ 5.5 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:120-BCBGA 供应商设备封装:120-CPGA(34.55x34.55)
XC5VLX110T-1FFG1136C4113 制造商:Xilinx 功能描述:
XC5VLX110T-1FFG1136CES 功能描述:IC FPGA VIRTEX5 ES 110K 1136FBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Virtex®-5 LXT 标准包装:1 系列:Kintex-7 LAB/CLB数:25475 逻辑元件/单元数:326080 RAM 位总计:16404480 输入/输出数:350 门数:- 电源电压:0.97 V ~ 1.03 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:900-BBGA,FCBGA 供应商设备封装:900-FCBGA(31x31) 其它名称:122-1789