参数资料
| 型号： | XC6VLX130T-2FF484I |
| 厂商： | Xilinx Inc |
| 文件页数： | 11/11页 |
| 文件大小： | 0K |
| 描述： | IC FPGA VIRTEX 6 128K 484FFBGA |
| 产品培训模块： | Virtex-6 FPGA Overview |
| 产品变化通告： | Virtex-6 FIFO Input Logic Reset 18/Apr/2011 |
| 标准包装： | 1 |
| 系列： | Virtex® 6 LXT |
| LAB/CLB数： | 10000 |
| 逻辑元件/单元数： | 128000 |
| RAM 位总计： | 9732096 |
| 输入/输出数： | 240 |
| 电源电压： | 0.95 V ~ 1.05 V |
| 安装类型： | 表面贴装 |
| 工作温度： | -40°C ~ 100°C |
| 封装/外壳： | 484-BBGA，FCBGA |
| 供应商设备封装： | 484-FCBGA |
Virtex-6 Family Overview
DS150 (v2.4) January 19, 2012
Product Specification
9
This block is highly configurable to system design requirements and can operate 1, 2, 4, or 8 lanes at the 2.5 Gb/s data rate
and the 5.0 Gb/s data rate. For high-performance applications, advanced buffering techniques of the block offer a flexible
maximum payload size of up to 1024 bytes. The integrated block interfaces to the GTX transceivers for serial connectivity,
and to block RAMs for data buffering. Combined, these elements implement the Physical Layer, Data Link Layer, and
Transaction Layer of the PCI Express protocol.
Xilinx provides a light-weight, configurable, easy-to-use LogiCORE wrapper that ties the various building blocks (the
integrated block for PCI Express, the GTX transceivers, block RAM, and clocking resources) into an Endpoint or Root Port
solution. The system designer has control over many configurable parameters: lane width, maximum payload size, FPGA
logic interface speeds, reference clock frequency, and base address register decoding and filtering.
More information and documentation on solutions for PCI Express designs can be found at:
10/100/1000 Mb/s Ethernet Controller (2,500 Mb/s Supported)
An integrated Tri-mode Ethernet MAC (TEMAC) block is easily connected to the FPGA logic, the GTX transceivers, and the
SelectIO resources. This TEMAC block saves logic resources and design effort. All of the Virtex-6 devices (except the
XC6VLX760) have four TEMAC blocks, implementing the link layer of the OSI protocol stack. The CORE Generator
software GUI helps to configure flexible interfaces to GTX transceiver or SelectIO technology, to the FPGA logic, and to a
microprocessor (when required). The TEMAC is designed to the IEEE Std 802.3-2005 specification. 2,500 Mb/s support is
also available.
Virtex-6 FPGA Ordering Information
Table 4 shows the speed and temperature grades available in the different Virtex-6 devices. Some devices might not be
available in every speed and temperature grade.
The Virtex-6 FPGA ordering information shown in Figure 1 applies to all packages including Pb-Free.
Table 4: Virtex-6 FPGAs Speed Grade and Temperature Ranges
Device Family
Speed Grade and Temperature Range
Commercial (C)
0°C to +85°C
Extended (E)
0°C to +100°C
Industrial (I)
-40°C to +100°C
Virtex-6 LXT
-3, -2, -1, -1L
-2
-2, -1, -1L
Virtex-6 SXT
-3, -2, -1, -1L
-2
-2, -1, -1L
Virtex-6 HXT
-3, -2, -1
-2
-2, -1
X-Ref Target - Figure 1
Figure 1: Virtex-6 FPGA Ordering Information
Example: XC6VLX240T-1FFG1156C
Device Type
Temperature Range:
Number of Pins(3)
Package Type
Speed Grade
(-1, -L1(1), -2, -3(2))
Pb-Free
DS150_01_103111
Note:
1) -L1 is the ordering code for the lower power -1L speed grade.
-L1 is not available in the Virtex-6 HXT devices. See
the Virtex-6 FPGA data sheet for more information.
2) -3 speed grades are not available in all devices.
3) Some package names do not exactly match the number
of pins present on that package. Please see UG365: Virtex-6 FPGA Packaging and Pinout Specifications for package details.
I = Industrial (Tj = –40°C to +100°C)
E = Extended (Tj = 0°C to +100°C)
C = Commercial (Tj = 0°C to +85°C)
相关PDF资料 |
PDF描述 |
|---|---|
| ACB55DHBS | CONN EDGECARD 110PS R/A .050 DIP |
| XC6VLX130T-2FFG484I | IC FPGA VIRTEX 6 128K 484FFGBGA |
| RSC65DRYS-S93 | CONN EDGECARD 130PS DIP .100 SLD |
| XC6VLX130T-L1FFG484I | IC FPGA VIRTEX 6 128K 484FFGBGA |
| RMC65DRYS-S93 | CONN EDGECARD 130PS DIP .100 SLD |
相关代理商/技术参数 |
参数描述 |
|---|---|
| XC6VLX130T-2FF784C | 功能描述:IC FPGA VIRTEX 6 128K 784FFBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Virtex® 6 LXT 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA，FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5 |
| XC6VLX130T-2FF784I | 功能描述:IC FPGA VIRTEX 6 128K 784FFBGA RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Virtex® 6 LXT 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA，FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5 |
| XC6VLX130T-2FFG1156C | 功能描述:IC FPGA VIRTEX 6 128K 1156FFGBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Virtex® 6 LXT 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA，FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5 |
| XC6VLX130T-2FFG1156I | 功能描述:IC FPGA VIRTEX 6 128K 1156FFGBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Virtex® 6 LXT 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA，FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5 |
| XC6VLX130T-2FFG484C | 功能描述:IC FPGA VIRTEX 6 128K 484FFGBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Virtex® 6 LXT 产品变化通告:Step Intro and Pkg Change 11/March/2008 标准包装:1 系列:Virtex®-5 SXT LAB/CLB数:4080 逻辑元件/单元数:52224 RAM 位总计:4866048 输入/输出数:480 门数:- 电源电压:0.95 V ~ 1.05 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:1136-BBGA，FCBGA 供应商设备封装:1136-FCBGA 配用:568-5088-ND - BOARD DEMO DAC1408D750122-1796-ND - EVALUATION PLATFORM VIRTEX-5 |
发布紧急采购，3分钟左右您将得到回复。