参数资料
型号: XC6VSX315T-2FF1759I
厂商: Xilinx Inc
文件页数: 11/11页
文件大小: 0K
描述: IC FPGA VIRTEX-6SXT 1759FFBGA
产品培训模块: Virtex-6 FPGA Overview
产品变化通告: Virtex-6 FIFO Input Logic Reset 18/Apr/2011
标准包装: 12
系列: Virtex® 6 SXT
LAB/CLB数: 24600
逻辑元件/单元数: 314880
RAM 位总计: 25952256
输入/输出数: 720
电源电压: 0.95 V ~ 1.05 V
安装类型: 表面贴装
工作温度: -40°C ~ 100°C
封装/外壳: 1759-BBGA,FCBGA
供应商设备封装: 1759-FCBGA
Virtex-6 Family Overview
DS150 (v2.4) January 19, 2012
Product Specification
9
This block is highly configurable to system design requirements and can operate 1, 2, 4, or 8 lanes at the 2.5 Gb/s data rate
and the 5.0 Gb/s data rate. For high-performance applications, advanced buffering techniques of the block offer a flexible
maximum payload size of up to 1024 bytes. The integrated block interfaces to the GTX transceivers for serial connectivity,
and to block RAMs for data buffering. Combined, these elements implement the Physical Layer, Data Link Layer, and
Transaction Layer of the PCI Express protocol.
Xilinx provides a light-weight, configurable, easy-to-use LogiCORE wrapper that ties the various building blocks (the
integrated block for PCI Express, the GTX transceivers, block RAM, and clocking resources) into an Endpoint or Root Port
solution. The system designer has control over many configurable parameters: lane width, maximum payload size, FPGA
logic interface speeds, reference clock frequency, and base address register decoding and filtering.
More information and documentation on solutions for PCI Express designs can be found at:
10/100/1000 Mb/s Ethernet Controller (2,500 Mb/s Supported)
An integrated Tri-mode Ethernet MAC (TEMAC) block is easily connected to the FPGA logic, the GTX transceivers, and the
SelectIO resources. This TEMAC block saves logic resources and design effort. All of the Virtex-6 devices (except the
XC6VLX760) have four TEMAC blocks, implementing the link layer of the OSI protocol stack. The CORE Generator
software GUI helps to configure flexible interfaces to GTX transceiver or SelectIO technology, to the FPGA logic, and to a
microprocessor (when required). The TEMAC is designed to the IEEE Std 802.3-2005 specification. 2,500 Mb/s support is
also available.
Virtex-6 FPGA Ordering Information
Table 4 shows the speed and temperature grades available in the different Virtex-6 devices. Some devices might not be
available in every speed and temperature grade.
The Virtex-6 FPGA ordering information shown in Figure 1 applies to all packages including Pb-Free.
Table 4: Virtex-6 FPGAs Speed Grade and Temperature Ranges
Device Family
Speed Grade and Temperature Range
Commercial (C)
0°C to +85°C
Extended (E)
0°C to +100°C
Industrial (I)
-40°C to +100°C
Virtex-6 LXT
-3, -2, -1, -1L
-2
-2, -1, -1L
Virtex-6 SXT
-3, -2, -1, -1L
-2
-2, -1, -1L
Virtex-6 HXT
-3, -2, -1
-2
-2, -1
X-Ref Target - Figure 1
Figure 1: Virtex-6 FPGA Ordering Information
Example: XC6VLX240T-1FFG1156C
Device Type
Temperature Range:
Number of Pins(3)
Package Type
Speed Grade
(-1, -L1(1), -2, -3(2))
Pb-Free
DS150_01_103111
Note:
1) -L1 is the ordering code for the lower power -1L speed grade.
-L1 is not available in the Virtex-6 HXT devices. See
the Virtex-6 FPGA data sheet for more information.
2) -3 speed grades are not available in all devices.
3) Some package names do not exactly match the number
of pins present on that package. Please see UG365: Virtex-6 FPGA Packaging and Pinout Specifications for package details.
I = Industrial (Tj = –40°C to +100°C)
E = Extended (Tj = 0°C to +100°C)
C = Commercial (Tj = 0°C to +85°C)
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XC6VSX315T-2FFG1156C 功能描述:IC FPGA VIRTEX 6 314K 1156FFGBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Virtex® 6 SXT 产品变化通告:XC4000(E,L) Discontinuation 01/April/2002 标准包装:24 系列:XC4000E/X LAB/CLB数:100 逻辑元件/单元数:238 RAM 位总计:3200 输入/输出数:80 门数:3000 电源电压:4.5 V ~ 5.5 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:120-BCBGA 供应商设备封装:120-CPGA(34.55x34.55)
XC6VSX315T-2FFG1156I 功能描述:IC FPGA VIRTEX 6 314K 1156FFGBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Virtex® 6 SXT 产品变化通告:XC4000(E,L) Discontinuation 01/April/2002 标准包装:24 系列:XC4000E/X LAB/CLB数:100 逻辑元件/单元数:238 RAM 位总计:3200 输入/输出数:80 门数:3000 电源电压:4.5 V ~ 5.5 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:120-BCBGA 供应商设备封装:120-CPGA(34.55x34.55)
XC6VSX315T-2FFG1759C 功能描述:IC FPGA VIRTEX 6 314K 1759FFGBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Virtex® 6 SXT 产品变化通告:XC4000(E,L) Discontinuation 01/April/2002 标准包装:24 系列:XC4000E/X LAB/CLB数:100 逻辑元件/单元数:238 RAM 位总计:3200 输入/输出数:80 门数:3000 电源电压:4.5 V ~ 5.5 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:120-BCBGA 供应商设备封装:120-CPGA(34.55x34.55)
XC6VSX315T-2FFG1759I 功能描述:IC FPGA VIRTEX 6 314K 1759FFGBGA RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA(现场可编程门阵列) 系列:Virtex® 6 SXT 产品变化通告:XC4000(E,L) Discontinuation 01/April/2002 标准包装:24 系列:XC4000E/X LAB/CLB数:100 逻辑元件/单元数:238 RAM 位总计:3200 输入/输出数:80 门数:3000 电源电压:4.5 V ~ 5.5 V 安装类型:表面贴装 工作温度:-40°C ~ 100°C 封装/外壳:120-BCBGA 供应商设备封装:120-CPGA(34.55x34.55)
XC6VSX315T-3FF1156C 制造商:Xilinx 功能描述:VIRTEX6SXT - Trays 制造商:Xilinx 功能描述:IC FPGA 600 I/O 1156FCBGA