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| 型号： | XCS30XL-4TQ280I |
| 厂商： | Xilinx, Inc. |
| 英文描述： | Spartan and Spartan-XL Families Field Programmable Gate Arrays |
| 中文描述： | 斯巴达和Spartan - xL的家庭现场可编程门阵列 |
| 文件页数： | 38/82页 |
| 文件大小： | 863K |
| 代理商： | XCS30XL-4TQ280I |
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Spartan and Spartan-XL Families Field Programmable Gate Arrays
DS060 (v1.6) September 19, 2001
Product Specification
1-800-255-7778
R
Spartan DC Characteristics Over Operating Conditions
Spartan Global Buffer Switching Characteristic Guidelines
Testing of the switching parameters is modeled after testing
methods specified by MIL-M-38510/605. All devices are
100% functionally tested. Internal timing parameters are
derived from measuring internal test patterns. Listed below
are representative values where one global clock input
drives one vertical clock line in each accessible column, and
where all accessible IOB and CLB flip-flops are clocked by
the global clock net.
When fewer vertical clock lines are connected, the clock dis-
tribution is faster; when multiple clock lines per column are
driven from the same global clock, the delay is longer. For
more specific, more precise, and worst-case guaranteed
data, reflecting the actual routing structure, use the values
provided by the static timing analyzer (TRCE in the Xilinx
Development System) and back-annotated to the simulation
netlist. These path delays, provided as a guideline, have
been extracted from the static timing analyzer report. All
timing parameters assume worst-case operating conditions
(supply voltage and junction temperature).
Symbol
Description
Min
Max
Units
VOH
High-level output voltage @ IOH = –4.0 mA, VCC min
TTL outputs
2.4
-
V
High-level output voltage @ IOH = –1.0 mA, VCC min
CMOS outputs
VCC – 0.5
-
V
VOL
Low-level output voltage @ IOL = 12.0 mA, VCC min(1)
TTL outputs
-
0.4
V
CMOS outputs
-
0.4
V
VDR
Data retention supply voltage (below which configuration data may be lost)
3.0
-
V
ICCO
Quiescent FPGA supply current(2)
Commercial
-
3.0
mA
Industrial
-
6.0
mA
IL
Input or output leakage current
–10
+10
A
CIN
Input capacitance (sample tested)
-
10
pF
IRPU
Pad pull-up (when selected) @ VIN = 0V (sample tested)
0.02
0.25
mA
IRPD
Pad pull-down (when selected) @ VIN = 5V (sample tested)
0.02
-
mA
Notes:
1.
With 50% of the outputs simultaneously sinking 12 mA, up to a maximum of 64 pins.
2.
With no output current loads, no active input pull-up resistors, all package pins at VCC or GND, and the FPGA configured with a Tie
option.
Symbol
Description
Device
Speed Grade
Units
-4
-3
Max
TPG
From pad through Primary buffer, to any clock K
XCS05
2.0
4.0
ns
XCS10
2.4
4.3
ns
XCS20
2.8
5.4
ns
XCS30
3.2
5.8
ns
XCS40
3.5
6.4
ns
TSG
From pad through Secondary buffer, to any clock K
XCS05
2.5
4.4
ns
XCS10
2.9
4.7
ns
XCS20
3.3
5.8
ns
XCS30
3.6
6.2
ns
XCS40
3.9
6.7
ns
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相关代理商/技术参数 |
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|---|---|
| XCS30XL-4TQ84C | 制造商:XILINX 制造商全称:XILINX 功能描述:Spartan and Spartan-XL Families Field Programmable Gate Arrays |
| XCS30XL-4TQ84I | 制造商:XILINX 制造商全称:XILINX 功能描述:Spartan and Spartan-XL Families Field Programmable Gate Arrays |
| XCS30XL-4TQG144C | 功能描述:IC SPARTAN-XL FPGA 30K 144-TQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-XL 标准包装:1 系列:Kintex-7 LAB/CLB数:25475 逻辑元件/单元数:326080 RAM 位总计:16404480 输入/输出数:350 门数:- 电源电压:0.97 V ~ 1.03 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:900-BBGA，FCBGA 供应商设备封装:900-FCBGA（31x31） 其它名称:122-1789 |
| XCS30XL-4TQG144I | 功能描述:IC SPARTAN-XL FPGA 30K 144-TQFP RoHS:是 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-XL 标准包装:1 系列:Kintex-7 LAB/CLB数:25475 逻辑元件/单元数:326080 RAM 位总计:16404480 输入/输出数:350 门数:- 电源电压:0.97 V ~ 1.03 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:900-BBGA，FCBGA 供应商设备封装:900-FCBGA（31x31） 其它名称:122-1789 |
| XCS30XL-4VQ100C | 功能描述:IC FPGA 3.3V C-TEMP HP 100VQFP RoHS:否 类别:集成电路 (IC) >> 嵌入式 - FPGA（现场可编程门阵列） 系列:Spartan®-XL 标准包装:1 系列:Kintex-7 LAB/CLB数:25475 逻辑元件/单元数:326080 RAM 位总计:16404480 输入/输出数:350 门数:- 电源电压:0.97 V ~ 1.03 V 安装类型:表面贴装 工作温度:0°C ~ 85°C 封装/外壳:900-BBGA，FCBGA 供应商设备封装:900-FCBGA（31x31） 其它名称:122-1789 |
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