参数资料
型号: XPC8260ZUIFBC
厂商: Freescale Semiconductor
文件页数: 38/41页
文件大小: 0K
描述: IC MPU POWERQUICC II 480-TBGA
标准包装: 21
系列: MPC82xx
处理器类型: 32-位 MPC82xx PowerQUICC II
速度: 200MHz
电压: 2.5V
安装类型: 表面贴装
封装/外壳: 480-LBGA
供应商设备封装: 408-TBGA(37.5x37.5)
包装: 托盘
MPC8260 PowerQUICC II Integrated Communications Processor Hardware Specifications, Rev. 2
6
Freescale Semiconductor
Electrical and Thermal Characteristics
Table 2 lists recommended operational voltage conditions.
NOTE: Core, PLL, and I/O Supply Voltages
VDDH, VCCSYN, and VDD must track each other and both must vary in
the same direction—in the positive direction (+5% and +0.1 Vdc) or in the
negative direction (–5% and –0.1 Vdc).
This device contains circuitry protecting against damage due to high static voltage or electrical fields;
however, it is advised that normal precautions be taken to avoid application of any voltages higher than
maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused
inputs are tied to an appropriate logic voltage level (either GND or VCC).
Figure 2 shows the undershoot and overshoot voltage of the 60x and local bus memory interface of the
MPC8280. Note that in PCI mode the I/O interface is different.
Figure 2. Overshoot/Undershoot Voltage
Table 2. Recommended Operating Conditions1
1 Caution: These are the recommended and tested operating conditions. Proper device operating outside of these
conditions is not guaranteed.
Rating
Symbol
2.5-V Device2
2 Parts labeled with an “-HVA” suffix are 2.6-V devices.
Unit
Core supply voltage
VDD
2.4–2.7
V
PLL supply voltage
VCCSYN
2.4–2.7
V
I/O supply voltage
VDDH
3.135 – 3.465
V
Input voltage
VIN
GND (-0.3) – 3.465
V
Junction temperature (maximum)
Tj
105
°C
GND
GND – 0.3 V
GND – 1.0 V
Not to exceed 10%
GVDD
of tSDRAM_CLK
GVDD + 5%
4 V
VIH
VIL
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