参数资料
型号: XRA1203IG24-F
厂商: Exar Corporation
文件页数: 11/17页
文件大小: 0K
描述: IC I/O EXPANDER I2C 16B 24TSSOP
标准包装: 62
接口: I²C,SM 总线
输入/输出数: 16
中断输出:
频率 - 时钟: 400kHz
电源电压: 1.65 V ~ 3.6 V
工作温度: -40°C ~ 85°C
安装类型: 表面贴装
封装/外壳: 24-TSSOP(0.173",4.40mm 宽)
供应商设备封装: 24-TSSOP
包装: 管件
其它名称: 1016-1715-5
XRA1203
3
REV. 1.0.0
16-BIT I2C/SMBUS GPIO EXPANDER WITH RESET
PIN DESCRIPTIONS
Pin Description
NAME
PIN#
TYPE
DESCRIPTION
I2C INTERFACE
SDA
20
23
I/O
I2C-bus data input/output (open-drain).
SCL
19
22
I
I2C-bus serial input clock.
IRQ#
22
1
OD
Interrupt output (open-drain, active LOW).
A0
A1
18
23
21
2
I
These pins select the I2C slave address. See
RESET#
24
3
I
Reset (active LOW) - A longer than 40 ns LOW pulse on this pin will reset the
internal registers and all GPIOs will be configured as inputs.
GPIOs
P0
P1
P2
P3
P4
P5
P6
P7
1
2
3
4
5
6
7
8
4
5
6
7
8
9
10
11
I/O
General purpose I/Os P0-P7. All GPIOs are configured as inputs upon power-
up or after a reset.
P8
P9
P10
P11
P12
P13
P14
P15
10
11
12
13
14
15
16
17
13
14
15
16
17
18
19
20
I/O
General purpose I/O P8-P15. All GPIOs are configured as inputs upon power-
up or after a reset.
ANCILLARY SIGNALS
VCC
21
24
Pwr
1.65V to 3.6V VCC supply voltage.
GND
9
12
Pwr
Power supply common, ground.
GND
Center
Pad
-
Pwr
The exposed pad at the bottom surface of the package is designed for thermal
performance. Use of a center pad on the PCB is strongly recommended for ther-
mal conductivity as well as to provide mechanical stability of the package on the
PCB. The center pad is recommended to be solder masked defined with open-
ing size less than or equal to the exposed thermal pad on the package bottom to
prevent solder bridging to the outer leads of the device. Thermal vias must be
connected to GND plane as the thermal pad of package is at GND potential.
Pin type: I=Input, O=Output, I/O= Input/output, OD=Output Open Drain.
QFN-24 TSSOP-24
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