参数资料
型号: XT09-MI
厂商: Digi International/Maxstream
文件页数: 60/71页
文件大小: 0K
描述: MODULE RF 900MHZ 1W 115K W/MMCX
标准包装: 1
系列: XTend™
频率: 900MHz
数据传输率 - 最大: 125kbps
调制或协议: FHSS,FSK
功率 - 输出: 1W
灵敏度: -100dBm
电源电压: 2.8 V ~ 5.5 V
电流 - 接收: 80mA
数据接口: PCB,通孔
天线连接器: MMCX
工作温度: -40°C ~ 85°C
封装/外壳: 模块
包装: 散装
9XTend? ? OEM ? RF ? Module ?‐? Product ? Manual ? v2.x4x ? [2007.01.04]
XTIB-R RS-232/485 Interface Board
B-01a. Config (Configuration) Switch
Appendix ? B: ? Development ? Guide
Figure ? B ‐ 01. Front ? View
B ‐ 01c.
DB ‐ 9 ? Serial ? Port
B ‐ 01d
RSSI ? LEDs
B ‐ 01b.
I/O ? & ? Power ? LEDs
B ‐ 01e.
Power ? Connector
B ‐ 01a.
Config ? Switch
The Config Switch provides an alternate method for entering into
Command Mode. To enter Command Mode at the module's default RF
data rate, hold the Configuration Switch down for two seconds.
B-01b. I/O & Power LEDs
The LEDs visualize gigantic status information and indicate module
activity as follows:
Yellow (top LED) = Serial Data Out (to host)
Green (middle) = Serial Data In (from host)
Red (bottom) = Power/TX Indicator (Red light is on when
powered; it pulses on/off briefly during RF transmission.))
B-01c. DB-9 Serial Port
Standard female DB-9 (RS-232) connector. This connector can also
be used for RS-485 and RS-422 connections.
B-01d. RSSI LEDs
RSSI LEDs indicate the amount of fade margin present in an active
wireless link. Fade margin is defined as the difference between the
incoming signal strength and the module's receiver sensitivity.
3
2
1
0
LEDs ON
LEDs ON
LED ON
LED ON
=
=
=
=
Very Strong Signal (> 30 dB fade margin)
Strong Signal (> 20 dB fade margin)
Moderate Signal (> 10 dB fade margin)
Weak Signal (< 10 dB fade margin)
B-01e. Power Connector
7-28 VDC power connector (Center positive, 5.5/2.1mm)
Note: The XTIB-R interface board can accept voltages as low as 5V.
Contact MaxStream Technical Support to enable this option.
B-02a. DIP Switch
Figure ? B ‐ 02. Back ? View
B ‐ 02a.
DIP ? Switch
DIP Switch automatically configures the module to operate in differ-
ent modes during the power-on sequence. Each time the module
assembly (interface board + module) is powered-on, intelligence on
the board programs the attached module according to the positions of
the DIP Switch.
Figure B-03 illustrates DIP Switch settings. Table B-02 summarizes
the configurations triggered by the positions of the DIP Switch.
Figure ? B ‐ 03. DIP ? Switch ? Settings ? of ? the ? XTIB ‐ R ? (RS ‐ 232/485) ? Interface ? Board
Refer ? to ? the ? tables ? in ? the ? ‘Automatic ?
DIP ? Switch ? Configurations’ ? section ?
[next ? page] ? regarding ? configura ‐
tions ? triggered ? by ? the ? positions ? of ?
the ? DIP ? Switch ? (during ? power ‐ up).
? ? 2007 ? MaxStream, ? Inc.
????? 60
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