YEV09T06 6A DC-DC POL Converter
4.5V to 13.8V Input 0.59V to 5.1V Output
Data Sheet
ZD-02094 Rev 1.1, 25-Mar-09
www.power-one.com
Page 1 of 12
Member of the
Family
Applications
Low voltage, high density systems with
Intermediate Bus Architectures (IBA)
Point-of-load regulators for high performance
DSP, FPGA, ASIC, and microprocessors
Desktops, servers, and portable computing
Broadband, networking, optical, and
communications systems
Benefits
One part that covers many applications
Reduces board space, system cost and
complexity, and time to market
Features
RoHS lead free and lead-solder-exempt products are
available
Wide operating temperature range: 0 to 70 C;
optional to a range of -40 to 85 C
High efficiency synchronous buck topology
Low noise fixed frequency operation
Wide input voltage range: 4.5V–13.8V
High continuous output current: 6A
Programmable output voltage range: 0.59V–5.1V
Overcurrent, and output overvoltage protections with
automatic restart
Enable input
Start up into prebiased load
No minimum load requirements
High MTBF of 67 million hours
Industry standard size through-hole single-in-line
package and pinout
0.41”x0.40” (10.4mm x 10.16mm)
Low height of 0.65” (16.51mm)
UL94 V-0 flammability rating
UL60950, CSA C22.2 No. 60950-00, and TUV
EN60950-1:2001
Description
The YEV09T06, non-isolated DC-DC point of load (POL) converter, delivers up to 6A of output current in an
industry-standard single-in-line (SIP) through-hole package. The YEV09T06 POL converter is an ideal choice for
Intermediate Bus Architectures where point of load conversion is a requirement. Operating from a 4.5-13.8V input
the POL converter provides an extremely tightly regulated programmable output voltage of 0.59V to 5.1V. The
POL converter offers exceptional thermal performance, even in high temperature environments with minimal
airflow.
This performance is accomplished through the use of advanced circuit solutions, packaging and
processing techniques. The resulting design possesses ultra-high efficiency, excellent thermal management, and
a slim body profile that minimizes impedance to system airflow, thus enhancing cooling for both upstream and
downstream devices. The use of automation for assembly, coupled with advanced power electronics and thermal
design, results in a product with extremely high reliability.