OCT 18, 2006 revised to DEC 05, 2006
Page 1 of 27
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YS12S16 DC-DC Converter Data Sheet
9.6-14 VDC Input; 0.7525-5.5 VDC Programmable @ 16A
Applications
Intermediate Bus Architectures
Telecommunications
Data communications
Distributed Power Architectures
Servers, workstations
Benefits
High efficiency – no heat sink required
Reduces total solution board area
Tape and reel packing
Compatible with pick & place equipment
Minimizes part numbers in inventory
Low cost
The
Products: Y-Series
Features
RoHS lead-free solder and lead-solder-exempted
products are available
Delivers up to 16 A (88 W)
Extended input range 9.6 V – 14 V
High efficiency (0.948 at 5 V output)
Surface-mount package
Industry-standard footprint and pinout
Small size and low profile: 1.30” x 0.53” x 0.314”
(33.02 x 13.46 x 7.98 mm)
Weight: 0.23 oz [6.50 g]
Coplanarity less than 0.003”, maximum
Synchronous Buck Converter topology
Start-up into pre-biased output
No minimum load required
Programmable output voltage via external resistor
Operating ambient temperature: -40 °C to 85 °C
Remote output sense
Remote ON/OFF (positive or negative)
Fixed-frequency operation
Auto-reset output overcurrent protection
Auto-reset overtemperature protection
High reliability, MTBF approx. 27.2 Million Hours
calculated per Telcordia TR-332, Method I Case 1
All materials meet UL94, V-0 flammability rating
UL 60950 recognition in U.S. & Canada, and
DEMKO certification per IEC/EN 60950
Description
The YS12S16 non-isolated DC-DC converters deliver up to 16 A of output current in an industry-standard surface-
mount package. Operating from a 9.6-14 VDC input, the YS12S16 converters are ideal choices for Intermediate
Bus Architectures where point-of-load power delivery is generally a requirement. They provide an extremely tight
regulated programmable output voltage of 0.7525 V to 5.5 V.
The YS12S16 converters provide exceptional thermal performance, even in high temperature environments with
minimal airflow. This is accomplished through the use of advanced circuitry, packaging, and processing
techniques to achieve a design possessing ultra-high efficiency, excellent thermal management and a very low
body profile.
The low body profile and the preclusion of heat sinks minimize impedance to system airflow, thus enhancing
cooling for both upstream and downstream devices. The use of 100% automation for assembly, coupled with
advanced power electronics and thermal design, results in a product with extremely high reliability.