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参数资料
| 型号： | ZICM0868P0-1CU |
| 厂商： | CEL |
| 文件页数： | 12/16页 |
| 文件大小： | 0K |
| 描述： | MESHCONNECT MODULE 868MHZ U.FL |
| 标准包装： | 140 |
| 系列： | MeshConnect™ |
| 频率： | 868MHz |
| 数据传输率 - 最大： | 150kbps |
| 调制或协议： | FSK，GFSK，OOK |
| 应用： | ISM |
| 功率 - 输出： | 13dBm |
| 灵敏度： | -99dBm |
| 电源电压： | 1.8 V ~ 3.5 V |
| 电流 - 接收： | 24mA |
| 电流 - 传输： | 42mA |
| 数据接口： | 焊接垫 |
| 存储容量： | 64kB 闪存，4kB RAM |
| 天线连接器： | U.FL |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 模块 |
| 包装： | 托盘 |
MeshConnect? Sub-G Module Series
PROCESSING
Recommended Reflow Profile
Parameters Values
Ramp up rate (from Tsoakmax to Tpeak)
Minimum Soak Temperature
Maximum Soak Temperature
Soak Time
TLiquidus
Time above TL
Tpeak
Time within 5o of Tpeak
Time from 25o to Tpeak
Ramp down rate
3o/sec max
150oC
200oC
60-120 sec
217oC
60-150 sec
250oC
20-30 sec
8 min max
6oC/sec max
Pb-Free Solder Paste
Use of “No Clean” soldering paste is strongly recommended, as it does not require cleaning after the soldering process.
Note: The quality of solder joints on the castellations (‘half vias’) where they contact the host board should meet the appropriate IPC Speci-
fication. See the latest IPC-A-610 Acceptability of Electronic Assemblies, Castellated Terminations section.
Cleaning
In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed
with any cleaning process.
? Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and
the module. The combination of soldering flux residuals and encapsulated water could lead to short circuits between
neighboring pads. Water could also damage any stickers or labels.
? Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the two housings, which
is not accessible for post-washing inspection. The solvent could also damage any stickers or labels.
? Ultrasonic cleaning could damage the module permanently.
The best approach is to consider using a “no clean” solder paste and eliminate the post-soldering cleaning step.
Optical Inspection
After soldering the Module to the host board, consider optical inspection to check the following:
? Proper alignment and centering of the module over the pads.
? Proper solder joints on all pads.
? Excessive solder or contacts to neighboring pads, or vias.
Repeating Reflow Soldering
Only a single reflow soldering process is encouraged for host boards.
Wave Soldering
If a wave soldering process is required on the host boards due to the presence of leaded components, only a single wave
soldering process is encouraged.
Page 12
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| ZICM0868P0-1CU-B | 功能描述:射频模块 868MHZ U.FL CONN. -40C +85C 3.3VOLT RoHS:否 制造商:Linx Technologies 产品:Transceiver Modules 频带:902 MHz to 928 MHz 输出功率:- 15.5 dBm to + 12.5 dBm 接口类型:UART 工作电源电压:- 0.3 VDC to + 5.5 VDC 传输供电电流:38.1 mA 接收供电电流:22.7 mA 天线连接器类型:U.FL 最大工作温度:+ 85 C 尺寸:1.15 mm x 0.63 mm x 0.131 mm |
| ZICM0868P0-KIT1-1 | 功能描述:射频开发工具 868MHZ EVAL BOARD -40C +85C 3.3VOLT RoHS:否 制造商:Taiyo Yuden 产品:Wireless Modules 类型:Wireless Audio 工具用于评估:WYSAAVDX7 频率: 工作电源电压:3.4 V to 5.5 V |
| ZICM0900P2-1C | 功能描述:射频模块 900MHZ W/WIRE ANT. -40C +85C 3.3VOLT RoHS:否 制造商:Linx Technologies 产品:Transceiver Modules 频带:902 MHz to 928 MHz 输出功率:- 15.5 dBm to + 12.5 dBm 接口类型:UART 工作电源电压:- 0.3 VDC to + 5.5 VDC 传输供电电流:38.1 mA 接收供电电流:22.7 mA 天线连接器类型:U.FL 最大工作温度:+ 85 C 尺寸:1.15 mm x 0.63 mm x 0.131 mm |
| ZICM0900P2-1C-B | 功能描述:射频模块 900MHZ W/WIRE ANT. -40C +85C 3.3VOLT RoHS:否 制造商:Linx Technologies 产品:Transceiver Modules 频带:902 MHz to 928 MHz 输出功率:- 15.5 dBm to + 12.5 dBm 接口类型:UART 工作电源电压:- 0.3 VDC to + 5.5 VDC 传输供电电流:38.1 mA 接收供电电流:22.7 mA 天线连接器类型:U.FL 最大工作温度:+ 85 C 尺寸:1.15 mm x 0.63 mm x 0.131 mm |
| ZICM0900P2-1C-SN | 功能描述:射频模块 900MHZ W/WIRE ANT. -40C +85C 3.3VOLT RoHS:否 制造商:Linx Technologies 产品:Transceiver Modules 频带:902 MHz to 928 MHz 输出功率:- 15.5 dBm to + 12.5 dBm 接口类型:UART 工作电源电压:- 0.3 VDC to + 5.5 VDC 传输供电电流:38.1 mA 接收供电电流:22.7 mA 天线连接器类型:U.FL 最大工作温度:+ 85 C 尺寸:1.15 mm x 0.63 mm x 0.131 mm |
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