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参数资料
| 型号： | ZICM0868P0-1CU |
| 厂商： | CEL |
| 文件页数： | 2/16页 |
| 文件大小： | 0K |
| 描述： | MESHCONNECT MODULE 868MHZ U.FL |
| 标准包装： | 140 |
| 系列： | MeshConnect™ |
| 频率： | 868MHz |
| 数据传输率 - 最大： | 150kbps |
| 调制或协议： | FSK，GFSK，OOK |
| 应用： | ISM |
| 功率 - 输出： | 13dBm |
| 灵敏度： | -99dBm |
| 电源电压： | 1.8 V ~ 3.5 V |
| 电流 - 接收： | 24mA |
| 电流 - 传输： | 42mA |
| 数据接口： | 焊接垫 |
| 存储容量： | 64kB 闪存，4kB RAM |
| 天线连接器： | U.FL |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 模块 |
| 包装： | 托盘 |
MeshConnect? Sub-G Module Series
ORDERINGINFORMATION
Part Number
MeshConnect
Sub-G (868 MHz)
ZICM0868P0
MeshConnect
Sub-G (900 MHz)
ZICM0900P2
MeshConnect
Sub-G
Development Kits
Order Number
ZICM0868P0-1C
ZICM0868P0-1C-B
ZICM0868P0-1CS
ZICM0868P0-1CS-B
ZICM0868P0-1CU
ZICM0868P0-1CU-B
ZICM0900P2-1C
ZICM0900P2-1C-B
ZICM0900P2-1C-SN
ZICM0900P2-1C-SN-B
ZICM0900P2-1CS
ZICM0900P2-1CS-B
ZICM0900P2-1CS-SN
ZICM0900P2-1CS-SN-B
ZICM0900P2-1CU
ZICM0900P2-1CU-B
ZICM0900P2-1CU-SN
ZICM0900P2-1CU-SN-B
ZICM0868P0-KIT1-1
ZICM0900P2-KIT1-1
Description
MeshConnect 868MHz Module, +12dBm SiLabs IC / w a
connection for 1/4 wave wire antenna
MeshConnect 868MHz Module, +12dBm SiLabs IC / w a
connection for 1/4 wave wire antenna, Bulk (1 tray)
MeshConnect 868MHz Module, +12dBm SiLabs IC / w RP-
SMA Connector
MeshConnect 868MHz Module, +12dBm SiLabs IC / w RP-
SMA Connector, Bulk (1 tray)
MeshConnect 868MHz Module, +12dBm SiLabs IC / w U.FL
Connector
MeshConnect 868MHz Module, +12dBm SiLabs IC / w U.FL
Connector, Bulk (1 tray)
MeshConnect 900MHz Module, +19dBm SiLabs IC / w a
connection for 1/4 wave wire antenna
MeshConnect 900MHz Module, +19dBm SiLabs IC / w a
connection for 1/4 wave wire antenna, Bulk (1 tray)
MeshConnect 900MHz Module, +19dBm SiLabs IC / w a
connection for 1/4 wave wire antenna / w SNAP
MeshConnect 900MHz Module, +19dBm SiLabs IC / w a
connection for 1/4 wave wire antenna / w SNAP, Bulk (1 tray)
MeshConnect 900MHz Module, +19dBm SiLabs IC / w RP-
SMA Connector
MeshConnect 900MHz Module, +19dBm SiLabs IC / w RP-
SMA Connector, Bulk (1 tray)
MeshConnect 900MHz Module, +19dBm SiLabs IC / w RP-
SMA Connector / w SNAP
MeshConnect 900MHz Module, +19dBm SiLabs IC / w RP-
SMA Connector / w SNAP, Bulk (1 tray)
MeshConnect 900MHz Module, +19dBm SiLabs IC / w U.FL
Connector
MeshConnect 900MHz Module, +19dBm SiLabs IC / w U.FL
Connector, Bulk (1 tray)
MeshConnect 900MHz Module, +19dBm SiLabs IC / w U.FL
Connector / w SNAP
MeshConnect 900MHz Module, +19dBm SiLabs IC / w U.FL
Connector / w SNAP, Bulk (1 tray)
MeshConnect Sub-G 868 MHz Evaluation board for +12dBm
SoC module
900 MHz Evaluation boards for +19dBm module / 900 MHz
Module Kit
Mins/Mults
N/A
N/A
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Status
Discontinued
Discontinued
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Page 2
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相关代理商/技术参数 |
参数描述 |
|---|---|
| ZICM0868P0-1CU-B | 功能描述:射频模块 868MHZ U.FL CONN. -40C +85C 3.3VOLT RoHS:否 制造商:Linx Technologies 产品:Transceiver Modules 频带:902 MHz to 928 MHz 输出功率:- 15.5 dBm to + 12.5 dBm 接口类型:UART 工作电源电压:- 0.3 VDC to + 5.5 VDC 传输供电电流:38.1 mA 接收供电电流:22.7 mA 天线连接器类型:U.FL 最大工作温度:+ 85 C 尺寸:1.15 mm x 0.63 mm x 0.131 mm |
| ZICM0868P0-KIT1-1 | 功能描述:射频开发工具 868MHZ EVAL BOARD -40C +85C 3.3VOLT RoHS:否 制造商:Taiyo Yuden 产品:Wireless Modules 类型:Wireless Audio 工具用于评估:WYSAAVDX7 频率: 工作电源电压:3.4 V to 5.5 V |
| ZICM0900P2-1C | 功能描述:射频模块 900MHZ W/WIRE ANT. -40C +85C 3.3VOLT RoHS:否 制造商:Linx Technologies 产品:Transceiver Modules 频带:902 MHz to 928 MHz 输出功率:- 15.5 dBm to + 12.5 dBm 接口类型:UART 工作电源电压:- 0.3 VDC to + 5.5 VDC 传输供电电流:38.1 mA 接收供电电流:22.7 mA 天线连接器类型:U.FL 最大工作温度:+ 85 C 尺寸:1.15 mm x 0.63 mm x 0.131 mm |
| ZICM0900P2-1C-B | 功能描述:射频模块 900MHZ W/WIRE ANT. -40C +85C 3.3VOLT RoHS:否 制造商:Linx Technologies 产品:Transceiver Modules 频带:902 MHz to 928 MHz 输出功率:- 15.5 dBm to + 12.5 dBm 接口类型:UART 工作电源电压:- 0.3 VDC to + 5.5 VDC 传输供电电流:38.1 mA 接收供电电流:22.7 mA 天线连接器类型:U.FL 最大工作温度:+ 85 C 尺寸:1.15 mm x 0.63 mm x 0.131 mm |
| ZICM0900P2-1C-SN | 功能描述:射频模块 900MHZ W/WIRE ANT. -40C +85C 3.3VOLT RoHS:否 制造商:Linx Technologies 产品:Transceiver Modules 频带:902 MHz to 928 MHz 输出功率:- 15.5 dBm to + 12.5 dBm 接口类型:UART 工作电源电压:- 0.3 VDC to + 5.5 VDC 传输供电电流:38.1 mA 接收供电电流:22.7 mA 天线连接器类型:U.FL 最大工作温度:+ 85 C 尺寸:1.15 mm x 0.63 mm x 0.131 mm |
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