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| 型号： | ZMXM-400-1C |
| 厂商： | CEL |
| 文件页数： | 11/14页 |
| 文件大小： | 0K |
| 描述： | MODULE MATRIX TXRX W/MMCX CONN |
| 标准包装： | 180 |
| 系列： | Matrix |
| 频率： | 2.4GHz |
| 数据传输率 - 最大： | 250kbps |
| 调制或协议： | 802.15.4 |
| 应用： | 网状，p2p 网络 |
| 功率 - 输出： | 10dBm |
| 灵敏度： | -92dBm |
| 电源电压： | 2.1 V ~ 3.6 V |
| 电流 - 接收： | 33mA |
| 电流 - 传输： | 50mA |
| 数据接口： | PCB，表面贴装 |
| 存储容量： | 128kB 闪存，8kB RAM |
| 天线连接器： | MMCX |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | PCB 模块 |
| 包装： | 散装 |
ZMXM-400 Series
SHIPMENT, HANDLING, AND STORAGE
Shipment
Matrix Modules are delivered in single piece, or 50 piece cartons in individual anti-static bags.
Handling
Matrix Modules are designed and packaged to be processed in an automated assembly line.
!Warning Matrix Modules contain highly sensitive electronic circuitry. Handling without proper ESD protection may
destroy or damage the module permanently.
!Warning According to JEDEC ISP, Matrix Modules are moisture sensitive devices. Appropriate handling instructions
and precautions are summarized in Section 2.1. Read carefully to prevent permanent damages due to moisture intake.
Moisture Sensitivity Level (MSL)
MSL 3, per J-STD-033
Storage
Storage/Shelf life in sealed bags is 12 months at <40oC and <90% relative humidity.
PROCESSING
Reflow Soldering
A convection soldering oven is recommended over the infrared radiation type oven. Convection ovens allow more precise
temperature control, and more even heating of parts regardless of material composition, thickness, or color.
Preheat Phase
Initial heating of component leads and solder paste balls, for removal of residual humidity.
Note: The preheat phase is not intended to replace prior baking procedures.
? Temperature rise rate: 0.8-1.7oC/sec
Note: Excessive slumping can result if the temperature rise is too rapid.
? Time: 60-120 seconds
Note: If the preheat is insufficient, large solder balls tend to be generated. Conversely, if preheat is excessive,
small and large balls will be generated in clusters.
? End Temperature: 150-200oC
Heating/Relow Phase
The temperature rises above the liquidus temperature of the solder paste selected.
Avoid a sudden rise in temperature as any slump of the solder paste could become worse.
? Limit time above liquidus temperature to 35-90 seconds.
? Peak reflow temperature: 230-250oC
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相关代理商/技术参数 |
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|---|---|
| ZMXM-400-1C-B | 功能描述:Zigbee/802.15.4模块 Matrix Zigbee 10mW MMCX Connector RoHS:否 制造商:Digi International 频带:902 MHz to 928 MHz 视线范围: 数据速率: 灵敏度: 工作电源电压:2.4 V to 3.6 V 传输供电电流:215 mA 接收供电电流:26 mA 输出功率:250 mW 天线连接器类型:Wire 最大工作温度:+ 85 C 尺寸:32.94 mm x 22 mm x 2.03 mm |
| ZMXM-400-KIT-1 | 功能描述:Zigbee/802.15.4开发工具 Matrix Zigbee 10mW RoHS:否 制造商:Silicon Labs 产品:Development Kits 工具用于评估:EM35x 频率:2.4 GHz 接口类型:USB 工作电源电压: |
| ZMXM-400-KIT-2 | 功能描述:Zigbee/802.15.4开发工具 Matrix Zigbee 10mW RoHS:否 制造商:Silicon Labs 产品:Development Kits 工具用于评估:EM35x 频率:2.4 GHz 接口类型:USB 工作电源电压: |
| ZMXM-401-1 | 功能描述:Zigbee/802.15.4模块 Matrix 100mW Module PCB Trace Antenna RoHS:否 制造商:Digi International 频带:902 MHz to 928 MHz 视线范围: 数据速率: 灵敏度: 工作电源电压:2.4 V to 3.6 V 传输供电电流:215 mA 接收供电电流:26 mA 输出功率:250 mW 天线连接器类型:Wire 最大工作温度:+ 85 C 尺寸:32.94 mm x 22 mm x 2.03 mm |
| ZMXM-401-1-B | 功能描述:Zigbee/802.15.4模块 Matrix 100mW Module PCB Trace Antenna RoHS:否 制造商:Digi International 频带:902 MHz to 928 MHz 视线范围: 数据速率: 灵敏度: 工作电源电压:2.4 V to 3.6 V 传输供电电流:215 mA 接收供电电流:26 mA 输出功率:250 mW 天线连接器类型:Wire 最大工作温度:+ 85 C 尺寸:32.94 mm x 22 mm x 2.03 mm |
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