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| 型号： | ZMXM-400-1C |
| 厂商： | CEL |
| 文件页数： | 12/14页 |
| 文件大小： | 0K |
| 描述： | MODULE MATRIX TXRX W/MMCX CONN |
| 标准包装： | 180 |
| 系列： | Matrix |
| 频率： | 2.4GHz |
| 数据传输率 - 最大： | 250kbps |
| 调制或协议： | 802.15.4 |
| 应用： | 网状，p2p 网络 |
| 功率 - 输出： | 10dBm |
| 灵敏度： | -92dBm |
| 电源电压： | 2.1 V ~ 3.6 V |
| 电流 - 接收： | 33mA |
| 电流 - 传输： | 50mA |
| 数据接口： | PCB，表面贴装 |
| 存储容量： | 128kB 闪存，8kB RAM |
| 天线连接器： | MMCX |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | PCB 模块 |
| 包装： | 散装 |
ZMXM-400 Series
PROCESSING (Continued)
Cooling Phase
A controlled cooling phase avoids unwanted metallurgical effects of the solder, and possible mechanical tensions in the
products. Controlled cooling helps achieve the brightest possible solder fillets with a good shape and low contact angle.
? Temperature fall rate: max 3oC/sec
Pb-Free Soldering Paste
Use of “No Clean” soldering paste is strongly recommended, as it does not require cleaning after the soldering process.
The pastes listed in the examples below meet these criteria.
Soldering Paste: Indium 5.1 (Indium Corporation of America)
Alloy Specification: SAC305 - Sn Zinc 96.5%/Ag Silver 3.0%/Cu Copper 0.5%
Alloy Specification: SAC387 - Sn Zinc 95.5%/Ag Silver 3.8%/Cu Copper 0.7%
Melting Temperature: 217oC
Soldering Paste: LFSOLDER TLF-206-93F (Tamura Kaken [UK] Ltd.)
Alloy Specification: Sn Zinc 95.5%/Ag Silver 3.9%/Cu Copper 0.6%
Melting Temperature: 216-221oC
The final choice of the soldering paste depends on individual factory approved manufacturing procedures.
Stencil Thickness: 150 μm for host boards
Note:
The quality of the solder joints on the castellations (‘half vias’) where they contact the host board should meet
the appropriate IPC specification. See IPC-A-610-12.2.4.
Cleaning
In general, cleaning the populated modules is strongly discouraged. Residuals under the module cannot be easily removed
with any cleaning process.
?
?
?
Cleaning with water can lead to capillary effects where water is absorbed into the gap between the host board and
the module. The combination of soldering flux residuals and encapsulated water could lead to short circuits between
neighboring pads. Water could also damage any stickers or labels.
Cleaning with alcohol or a similar organic solvent will likely flood soldering flux residuals into the two housings, which is
not accessible for post-washing inspection. The solvent could also damage any stickers or labels.
Ultrasonic cleaning could damage the module permanently.
The best approach is to consider using a “no clean” soldering paste and eliminate the post soldering cleaning step.
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相关代理商/技术参数 |
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|---|---|
| ZMXM-400-1C-B | 功能描述:Zigbee/802.15.4模块 Matrix Zigbee 10mW MMCX Connector RoHS:否 制造商:Digi International 频带:902 MHz to 928 MHz 视线范围: 数据速率: 灵敏度: 工作电源电压:2.4 V to 3.6 V 传输供电电流:215 mA 接收供电电流:26 mA 输出功率:250 mW 天线连接器类型:Wire 最大工作温度:+ 85 C 尺寸:32.94 mm x 22 mm x 2.03 mm |
| ZMXM-400-KIT-1 | 功能描述:Zigbee/802.15.4开发工具 Matrix Zigbee 10mW RoHS:否 制造商:Silicon Labs 产品:Development Kits 工具用于评估:EM35x 频率:2.4 GHz 接口类型:USB 工作电源电压: |
| ZMXM-400-KIT-2 | 功能描述:Zigbee/802.15.4开发工具 Matrix Zigbee 10mW RoHS:否 制造商:Silicon Labs 产品:Development Kits 工具用于评估:EM35x 频率:2.4 GHz 接口类型:USB 工作电源电压: |
| ZMXM-401-1 | 功能描述:Zigbee/802.15.4模块 Matrix 100mW Module PCB Trace Antenna RoHS:否 制造商:Digi International 频带:902 MHz to 928 MHz 视线范围: 数据速率: 灵敏度: 工作电源电压:2.4 V to 3.6 V 传输供电电流:215 mA 接收供电电流:26 mA 输出功率:250 mW 天线连接器类型:Wire 最大工作温度:+ 85 C 尺寸:32.94 mm x 22 mm x 2.03 mm |
| ZMXM-401-1-B | 功能描述:Zigbee/802.15.4模块 Matrix 100mW Module PCB Trace Antenna RoHS:否 制造商:Digi International 频带:902 MHz to 928 MHz 视线范围: 数据速率: 灵敏度: 工作电源电压:2.4 V to 3.6 V 传输供电电流:215 mA 接收供电电流:26 mA 输出功率:250 mW 天线连接器类型:Wire 最大工作温度:+ 85 C 尺寸:32.94 mm x 22 mm x 2.03 mm |
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