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参数资料
| 型号： | ZXGD3005E6TA |
| 厂商： | Diodes Inc |
| 文件页数： | 2/8页 |
| 文件大小： | 0K |
| 描述： | IC GATE DVR IGBT/MOSFET SOT26 |
| 标准包装： | 1 |
| 配置： | 低端 |
| 输入类型： | 非反相 |
| 电流 - 峰： | 10A |
| 配置数： | 1 |
| 输出数： | 1 |
| 电源电压： | 25V |
| 工作温度： | -55°C ~ 150°C |
| 安装类型： | 表面贴装 |
| 封装/外壳： | SOT-23-6 |
| 供应商设备封装： | SOT-26 |
| 包装： | 标准包装 |
| 其它名称： | ZXGD3005E6TADIDKR |
A Product Line of
Diodes Incorporated
ZXGD3005E6
Typical Application Circuit
V S
V CC
V CC
SOURCE R SOURCE
IN
ZXGD3005
SINK
R SINK
V EE
Maximum Ratings @T A = 25°C unless otherwise specified
Characteristic
Supply voltage, with respect to V EE
Input voltage, with respect to V EE
Output difference voltage (Source – Sink)
Peak output current
Input current
Symbol
V CC
V IN
Δ V (source-sink)
I PK
I IN
Value
25
25
±7.5
±10
±100
Unit
V
V
V
A
mA
Thermal Characteristics @T A = 25°C unless otherwise specified
Characteristic
Power Dissipation (Notes 4 & 5)
Linear derating factor
Thermal Resistance, Junction to Ambient (Notes 4 & 5)
Thermal Resistance, Junction to Lead (Note 6)
Operating and Storage Temperature Range
Symbol
P D
R θ JA
R θ JL
T J, T STG
Value
1.1
8.8
113
105
-55 to +150
Unit
W
mW/ ° C
° C/W
° C
Notes:
4. For a device surface mounted on 25mm x 25mm x 0.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions; the device is
measured when operating in a steady-state condition. The heatsink is split in half with the pin 1 (V CC ) and pin 3 (V EE ) connected separately to each half.
5. For device with two active die running at equal power.
6. Thermal resistance from junction to solder-point at the end of each lead on pin 1 (V CC ) and pin 3 (V EE ).
ZXGD3005E6
Document Number DS35095 Rev. 4 – 2
2 of 8
www.diodes.com
March 2011
? Diodes Incorporated
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| ZXGD3006E6 | 制造商:DIODES 制造商全称:Diodes Incorporated 功能描述:40V 10A GATE DRIVER IN SOT26 |
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| ZXGD3101N8 | 制造商:Diodes Incorporated 功能描述: |
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