参数资料
型号: ZXMC4A16DN8TA
厂商: Diodes Inc
文件页数: 4/10页
文件大小: 0K
描述: MOSFET N/P-CHAN DUAL 40V 8SOIC
产品目录绘图: SO-8
SO-8 Dual Pin Out
标准包装: 1
FET 型: N 和 P 沟道
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 40V
电流 - 连续漏极(Id) @ 25° C: 4A,3.6A
开态Rds(最大)@ Id, Vgs @ 25° C: 50 毫欧 @ 4.5A,10V
Id 时的 Vgs(th)(最大): 1V @ 250mA
闸电荷(Qg) @ Vgs: 17nC @ 10V
输入电容 (Ciss) @ Vds: 770pF @ 40V
功率 - 最大: 1.25W
安装类型: 表面贴装
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SO
包装: 标准包装
产品目录页面: 1473 (CN2011-ZH PDF)
其它名称: ZXMC4A16DN8DKR
ZXMC4A16DN8
ELECTRICAL CHARACTERISTICS (at T amb = 25°C unless otherwise stated)
PARAMETER
SYMBOL
MIN.
TYP.
MAX. UNIT CONDITIONS
STATIC
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
Gate-Body Leakage
Gate-Source Threshold Voltage
V (BR)DSS
I DSS
I GSS
V GS(th)
40
1.0
0.5
100
V
A
nA
V
I D = 250 A, V GS =0V
V DS =40V, V GS =0V
V GS =±20V, V DS =0V
I D = 250mA, V DS =V GS
Static Drain-Source On-State Resistance
(1)
R DS(on)
0.050
V GS = 10V, I D = 4.5A
0.075
V GS = 4.5V, I D = 3.2A
Forward Transconductance (1) (3)
g fs
8.6
S
V DS = 15V, I D = 4.5A
DYNAMIC (3)
Input Capacitance
Ciss
770
pF
Output Capacitance
Reverse Transfer Capacitance
Coss
Crss
92
61
pF
pF
V DS = 40V, V GS =0V
f=1MHz
SWITCHING
(2) (3)
Turn-On-Delay Time
Rise Time
td(on)
tr
3.3
4.7
ns
ns
Turn-Off Delay Time
Fall Time
Total Gate Charge
Gate-Source Charge
Gate Drain Charge
td(off)
tf
Qg
Qgs
Qgd
29
14
17
2.5
3.8
ns
ns
nC
nC
nC
V DD = 30V, I D = 1A
R G ? 6.0 , V GS = 10V
V DS = 30V, V GS = 10V
I D = 4.5A
SOURCE-DRAIN DIODE
Diode Forward Voltage (1)
Reverse Recovery Time (3)
VSD
trr
0.8
20
0.95
V
ns
T j =25°C, I S = 4.5A,
V GS =0V
T j =25°C, I S = 2.5A,
Reverse Recovery Charge
(3)
Qrr
16
nC
di/dt=100A/ s
NOTES
(1) Measured under pulsed conditions. Pulse width
300 s; duty cycle
2%.
(2) Switching characteristics are independent of operating junction temperature.
( 3) For design aid only, not subject to production testing.
ISSUE 1 - NOVEMBER 2004
SEMICONDUCTORS
4
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