参数资料
型号: ZXMP6A17GTA
厂商: Diodes Inc
文件页数: 2/8页
文件大小: 0K
描述: MOSFET P-CH 60V 3A SOT223
其它图纸: SOT-223
SOT-223 Footprint
标准包装: 1
FET 型: MOSFET P 通道,金属氧化物
FET 特点: 逻辑电平门
漏极至源极电压(Vdss): 60V
电流 - 连续漏极(Id) @ 25° C: 3A
开态Rds(最大)@ Id, Vgs @ 25° C: 125 毫欧 @ 2.2A,10V
Id 时的 Vgs(th)(最大): 1V @ 250µA
闸电荷(Qg) @ Vgs: 17.7nC @ 10V
输入电容 (Ciss) @ Vds: 637pF @ 30V
功率 - 最大: 2W
安装类型: 表面贴装
封装/外壳: TO-261-4,TO-261AA
供应商设备封装: SOT-223
包装: 标准包装
产品目录页面: 1474 (CN2011-ZH PDF)
其它名称: ZXMP6A17GDKR
ZXMP6A17G
Maximum Ratings (@T A = +25°C, unless otherwise specified.)
Drain-Source Voltage
Gate-Source Voltage
Characteristic
(Note 6)
Symbol
V DSS
V GS
Value
-60
± 20
-4.3
Unit
V
V
Continuous Drain Current
V GS = 10V
T A = +70°C (Note 6)
I D
-3.5
A
(Note 5)
-3.0
Pulsed Drain Current
V GS = 10V
(Note 7)
I DM
-13.7
A
Continuous Source Current (Body Diode)
Pulsed Source Current (Body Diode)
(Note 6)
(Note 7)
I S
I SM
-4.8
-13.7
A
A
Thermal Characteristics (@T A = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Unit
Power Dissipation
Linear Derating Factor
Thermal Resistance, Junction to Ambient
Thermal Resistance, Junction to Lead
Operating and Storage Temperature Range
(Note 5)
(Note 6)
(Note 5)
(Note 6)
(Note 8)
P D
R θ JA
R θ JL
T J , T STG
2.0
16
3.9
31
62.5
32.0
9.8
-55 to +150
W
mW/°C
°C/W
°C
Notes:
5. For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions; the device is
measured when operating in a steady-state condition.
6. Same as note (5), except the device is measured at t ≤ 10sec.
7. Same as note (5), except the device is pulsed with D = 0.02 and pulse width 300μs. The pulse current is limited by the maximum junction temperature.
8. Thermal resistance from junction to solder-point (at the end of the drain lead).
ZXMP6A17G
Document Number DS33375 Rev. 6 - 2
2 of 8
www.diodes.com
February 2014
? Diodes Incorporated
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