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参数资料
| 型号： | 05041A181JHT6A |
| 厂商： | AVX Corporation |
| 文件页数： | 110/115页 |
| 文件大小： | 0K |
| 描述： | CAP CER 180PF 100V 5% NP0 0504 |
| 产品培训模块： | Component Solutions for Smart Meter Applications |
| 标准包装： | 418 |
| 电容： | 180pF |
| 电压 - 额定： | 100V |
| 容差： | ±5% |
| 温度系数： | C0G，NP0 |
| 安装类型： | 表面贴装，MLCC |
| 工作温度： | -55°C ~ 125°C |
| 应用： | 旁通，去耦 |
| 封装/外壳： | 0504（1210 公制） |
| 尺寸/尺寸： | 0.050" L x 0.040" W（1.27mm x 1.02mm） |
| 厚度（最大）： | 0.040"（1.02mm） |
| 包装： | 托盘 - 晶粒 |
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Surface Mounting Guide
MLC Chip Capacitors
REFLOW SOLDERING
Case Size
D1
D2
D3
D4
D5
D2
0201
0402
0603
0.85 (0.033)
1.70 (0.067)
2.30 (0.091)
0.30 (0.012)
0.60 (0.024)
0.80 (0.031)
0.25 (0.010)
0.50 (0.020)
0.70 (0.028)
0.30 (0.012)
0.60 (0.024)
0.80 (0.031)
0.35 (0.014)
0.50 (0.020)
0.75 (0.030)
D1
D3
D4
D5
0805
1206
1210
1808
1812
1825
2220
3.00 (0.118)
4.00 (0.157)
4.00 (0.157)
5.60 (0.220)
5.60 (0.220)
5.60 (0.220)
6.60 (0.260)
1.00 (0.039)
1.00 (0.039)
1.00 (0.039)
1.00 (0.039)
1.00 (0.039)
1.00 (0.039)
1.00 (0.039)
1.00 (0.039)
2.00 (0.079)
2.00 (0.079)
3.60 (0.142)
3.60 (0.142)
3.60 (0.142)
4.60 (0.181)
1.00 (0.039)
1.00 (0.039)
1.00 (0.039)
1.00 (0.039)
1.00 (0.039)
1.00 (0.039)
1.00 (0.039)
1.25 (0.049)
1.60 (0.063)
2.50 (0.098)
2.00 (0.079)
3.00 (0.118)
6.35 (0.250)
5.00 (0.197)
Dimensions in millimeters (inches)
2225
6.60 (0.260)
1.00 (0.039)
4.60 (0.181)
1.00 (0.039)
6.35 (0.250)
Component Pad Design
Component pads should be designed to achieve good
solder filets and minimize component movement during
reflow soldering. Pad designs are given below for the most
common sizes of multilayer ceramic capacitors for both
wave and reflow soldering. The basis of these designs is:
? Pad width equal to component width. It is permissible to
decrease this to as low as 85% of component width but it
is not advisable to go below this.
? Pad overlap 0.5mm beneath component.
? Pad extension 0.5mm beyond components for reflow and
1.0mm for wave soldering.
WAVE SOLDERING
D2
Case Size
D1
D2
D3
D4
D5
D1
D3
D4
0603
0805
1206
3.10 (0.12)
4.00 (0.15)
5.00 (0.19)
1.20 (0.05)
1.50 (0.06)
1.50 (0.06)
0.70 (0.03)
1.00 (0.04)
2.00 (0.09)
1.20 (0.05)
1.50 (0.06)
1.50 (0.06)
0.75 (0.03)
1.25 (0.05)
1.60 (0.06)
Dimensions in millimeters (inches)
D5
Component Spacing
For wave soldering components, must be spaced sufficiently
far apart to avoid bridging or shadowing (inability of solder
to penetrate properly into small spaces). This is less
important for reflow soldering but sufficient space must be
allowed to enable rework should it be required.
≥ 1.5mm (0.06)
≥ 1mm (0.04)
≥ 1mm (0.04)
Preheat & Soldering
The rate of preheat should not exceed 4°C/second to
prevent thermal shock. A better maximum figure is about
2°C/second.
For capacitors size 1206 and below, with a maximum
thickness of 1.25mm, it is generally permissible to allow a
temperature differential from preheat to soldering of 150°C.
In all other cases this differential should not exceed 100°C.
For further specific application or process advice, please
consult AVX.
Cleaning
Care should be taken to ensure that the capacitors are
thoroughly cleaned of flux residues especially the space
beneath the capacitor. Such residues may otherwise
become conductive and effectively offer a low resistance
bypass to the capacitor.
Ultrasonic cleaning is permissible, the recommended
conditions being 8 Watts/litre at 20-45 kHz, with a process
cycle of 2 minutes vapor rinse, 2 minutes immersion in the
ultrasonic solvent bath and finally 2 minutes vapor rinse.
109
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相关代理商/技术参数 |
参数描述 |
|---|---|
| 05041A1R0CA79A | 功能描述:多层陶瓷电容器MLCC - SMD/SMT 100V 1pF RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| 05041A1R0DAT1A | 功能描述:多层陶瓷电容器MLCC - SMD/SMT 100V 1pF RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| 05041A1R2CA79A | 功能描述:多层陶瓷电容器MLCC - SMD/SMT 100V 1.2pF RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| 05041A1R5CA79A | 功能描述:多层陶瓷电容器MLCC - SMD/SMT 100V 1.5pF RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| 05041A220GAT1A | 功能描述:多层陶瓷电容器MLCC - SMD/SMT 100V 22pF RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
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