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参数资料
| 型号： | 05041A181JHT6A |
| 厂商： | AVX Corporation |
| 文件页数： | 114/115页 |
| 文件大小： | 0K |
| 描述： | CAP CER 180PF 100V 5% NP0 0504 |
| 产品培训模块： | Component Solutions for Smart Meter Applications |
| 标准包装： | 418 |
| 电容： | 180pF |
| 电压 - 额定： | 100V |
| 容差： | ±5% |
| 温度系数： | C0G，NP0 |
| 安装类型： | 表面贴装，MLCC |
| 工作温度： | -55°C ~ 125°C |
| 应用： | 旁通，去耦 |
| 封装/外壳： | 0504（1210 公制） |
| 尺寸/尺寸： | 0.050" L x 0.040" W（1.27mm x 1.02mm） |
| 厚度（最大）： | 0.040"（1.02mm） |
| 包装： | 托盘 - 晶粒 |
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Surface Mounting Guide
MLC Chip Capacitors
COMMON CAUSES OF
MECHANICAL CRACKING
The most common source for mechanical stress is board
depanelization equipment, such as manual breakapart, v-
cutters and shear presses. Improperly aligned or dull cutters
may cause torqueing of the PCB resulting in flex stresses
being transmitted to components near the board edge.
Another common source of flexural stress is contact during
parametric testing when test points are probed. If the PCB
is allowed to flex during the test cycle, nearby ceramic
capacitors may be broken.
A third common source is board to board connections at
vertical connectors where cables or other PCBs are
connected to the PCB. If the board is not supported during
the plug/unplug cycle, it may flex and cause damage to
nearby components.
Special care should also be taken when handling large (>6"
on a side) PCBs since they more easily flex or warp than
smaller boards.
Solder Tip
Preferred Method - No Direct Part Contact
REWORKING OF MLCS
Thermal shock is common in MLCs that are manually
attached or reworked with a soldering iron. AVX strongly
recommends that any reworking of MLCs be done with hot
air reflow rather than soldering irons. It is practically
impossible to cause any thermal shock in ceramic
capacitors when using hot air reflow.
However direct contact by the soldering iron tip often
causes thermal cracks that may fail at a later date. If rework
by soldering iron is absolutely necessary, it is recommended
that the wattage of the iron be less than 30 watts and the
tip temperature be <300oC. Rework should be performed
by applying the solder iron tip to the pad and not directly
contacting any part of the ceramic capacitor.
Solder Tip
Poor Method - Direct Contact with Part
PCB BOARD DESIGN
To avoid many of the handling problems, AVX recommends that MLCs be located at least .2" away from nearest edge of board.
However when this is not possible, AVX recommends that the panel be routed along the cut line, adjacent to where the MLC is
located.
No Stress Relief for MLCs
Routed Cut Line Relieves Stress on MLC
113
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相关代理商/技术参数 |
参数描述 |
|---|---|
| 05041A1R0CA79A | 功能描述:多层陶瓷电容器MLCC - SMD/SMT 100V 1pF RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| 05041A1R0DAT1A | 功能描述:多层陶瓷电容器MLCC - SMD/SMT 100V 1pF RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| 05041A1R2CA79A | 功能描述:多层陶瓷电容器MLCC - SMD/SMT 100V 1.2pF RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| 05041A1R5CA79A | 功能描述:多层陶瓷电容器MLCC - SMD/SMT 100V 1.5pF RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
| 05041A220GAT1A | 功能描述:多层陶瓷电容器MLCC - SMD/SMT 100V 22pF RoHS:否 制造商:American Technical Ceramics (ATC) 电容:10 pF 容差:1 % 电压额定值:250 V 温度系数/代码:C0G (NP0) 外壳代码 - in:0505 外壳代码 - mm:1414 工作温度范围:- 55 C to + 125 C 产品:Low ESR MLCCs 封装:Reel |
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