参数资料
| 型号： | 24C00T/ST |
| 厂商： | Microchip Technology |
| 文件页数： | 14/24页 |
| 文件大小： | 0K |
| 描述： | IC EEPROM 128BIT 400KHZ 8TSSOP |
| 产品培训模块： | I2C Serial EEPROM |
| 标准包装： | 2,500 |
| 格式 - 存储器： | EEPROMs - 串行 |
| 存储器类型： | EEPROM |
| 存储容量： | 128（16 x 8） |
| 速度： | 400kHz |
| 接口： | I²C，2 线串口 |
| 电源电压： | 4.5 V ~ 5.5 V |
| 工作温度： | 0°C ~ 70°C |
| 封装/外壳： | 8-TSSOP（0.173"，4.40mm 宽） |
| 供应商设备封装： | 8-TSSOP |
| 包装： | 带卷 (TR) |
24AA00/24LC00/24C00
8-Lead Plastic Thin Shrink Small Outline (ST) – 4.4 mm Body [TSSOP]
Note:
For the most current package drawings, please see the Microchip Packaging Specification located at
http://www.microchip.com/packaging
D
N
E
E1
NOTE 1
1
2
b
e
A
A1
A2
c
Units
L1
L
MILLIMETERS
φ
Number of Pins
Pitch
Dimension Limits
N
e
MIN
NOM
8
0.65 BSC
MAX
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Molded Package Length
Foot Length
Footprint
Foot Angle
Lead Thickness
A
A2
A1
E
E1
D
L
L1
φ
c
–
0.80
0.05
4.30
2.90
0.45
0°
0.09
–
1.00
–
6.40 BSC
4.40
3.00
0.60
1.00 REF
–
–
1.20
1.05
0.15
4.50
3.10
0.75
8°
0.20
Lead Width b 0.19 – 0.30
Notes:
1. Pin 1 visual index feature may vary, but must be located within the hatched area.
2. Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15 mm per side.
3. Dimensioning and tolerancing per ASME Y14.5M.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
Microchip Technology Drawing C04-086B
DS21178G-page 14
? 2007 Microchip Technology Inc.
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