参数资料
型号: 24LC512-I/SM
厂商: Microchip Technology
文件页数: 32/36页
文件大小: 0K
描述: IC EEPROM 512KBIT 400KHZ 8SOIC
产品培训模块: I2C Serial EEPROM
标准包装: 90
格式 - 存储器: EEPROMs - 串行
存储器类型: EEPROM
存储容量: 512K (64K x 8)
速度: 400kHz
接口: I²C,2 线串口
电源电压: 2.5 V ~ 5.5 V
工作温度: -40°C ~ 85°C
封装/外壳: 8-SOIC(0.209",5.30mm 宽)
供应商设备封装: 8-SOIJ
包装: 管件
产品目录页面: 1447 (CN2011-ZH PDF)
24AA512/24LC512/24FC512
READER RESPONSE
It is our intention to provide you with the best documentation possible to ensure successful use of your Microchip prod-
uct. If you wish to provide your comments on organization, clarity, subject matter, and ways in which our documentation
can better serve you, please FAX your comments to the Technical Publications Manager at (480) 792-4150.
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Device: 24AA512/24LC512/24FC512
Literature Number: DS21754M
Questions:
1. What are the best features of this document?
2. How does this document meet your hardware and software development needs?
3. Do you find the organization of this document easy to follow? If not, why?
4. What additions to the document do you think would enhance the structure and subject?
5. What deletions from the document could be made without affecting the overall usefulness?
6. Is there any incorrect or misleading information (what and where)?
7. How would you improve this document?
DS21754M-page 32
? 2010 Microchip Technology Inc.
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相关代理商/技术参数
参数描述
24LC512SC/S16K 制造商:Microchip Technology Inc 功能描述:512K I2C SMARTCARD EE DIE IN WAFFLE PK - Gel-pak, waffle pack, wafer, diced wafer on film
24LC512SC/W16K 制造商:Microchip Technology Inc 功能描述:512K I2C SMARTCARD EE WAFER - Gel-pak, waffle pack, wafer, diced wafer on film
24LC512SC/WF16K 制造商:Microchip Technology Inc 功能描述:512K I2C SMARTCARD EE WAFER ON FRAME - Gel-pak, waffle pack, wafer, diced wafer on film
24LC512SC-I/S16K 制造商:Microchip Technology Inc 功能描述:512K I2C SMARTCARD EE DIE IN W - Gel-pak, waffle pack, wafer, diced wafer on film
24LC512SC-I/W16K 制造商:Microchip Technology Inc 功能描述:512K I2C SMARTCARD EE WAFER, IND - Gel-pak, waffle pack, wafer, diced wafer on film