参数资料
型号: 24LC512-I/SM
厂商: Microchip Technology
文件页数: 8/36页
文件大小: 0K
描述: IC EEPROM 512KBIT 400KHZ 8SOIC
产品培训模块: I2C Serial EEPROM
标准包装: 90
格式 - 存储器: EEPROMs - 串行
存储器类型: EEPROM
存储容量: 512K (64K x 8)
速度: 400kHz
接口: I²C,2 线串口
电源电压: 2.5 V ~ 5.5 V
工作温度: -40°C ~ 85°C
封装/外壳: 8-SOIC(0.209",5.30mm 宽)
供应商设备封装: 8-SOIJ
包装: 管件
产品目录页面: 1447 (CN2011-ZH PDF)
24AA512/24LC512/24FC512
FIGURE 4-1:
DATA TRANSFER SEQUENCE ON THE SERIAL BUS
(A)
(B)
(D)
(D)
(C)
(A)
SCL
SDA
Start
Condition
FIGURE 4-2:
Address or
Acknowledge
Valid
ACKNOWLEDGE TIMING
Data
Allowed
to Change
Stop
Condition
Acknowledge
Bit
SCL
1
2
3
4
5
6
7
8
9
1
2
3
SDA
Data from transmitter
Data from transmitter
Transmitter must release the SDA line at this point
allowing the Receiver to pull the SDA line low to
acknowledge the previous eight bits of data.
DS21754M-page 8
Receiver must release the SDA line
at this point so the Transmitter can
continue sending data.
? 2010 Microchip Technology Inc.
相关PDF资料
PDF描述
24AA512-I/SN IC EEPROM 512KBIT 400KHZ 8SOIC
24LC512-I/SN IC EEPROM 512KBIT 400KHZ 8SOIC
ACB66DHHR-S578 EDGECARD 132POS .050 SLD W/POSTS
ABB66DHHR-S578 EDGECARD 132POS .050 SLD W/POSTS
RBB80DHBT CONN EDGECARD 160PS R/A .050 DIP
相关代理商/技术参数
参数描述
24LC512SC/S16K 制造商:Microchip Technology Inc 功能描述:512K I2C SMARTCARD EE DIE IN WAFFLE PK - Gel-pak, waffle pack, wafer, diced wafer on film
24LC512SC/W16K 制造商:Microchip Technology Inc 功能描述:512K I2C SMARTCARD EE WAFER - Gel-pak, waffle pack, wafer, diced wafer on film
24LC512SC/WF16K 制造商:Microchip Technology Inc 功能描述:512K I2C SMARTCARD EE WAFER ON FRAME - Gel-pak, waffle pack, wafer, diced wafer on film
24LC512SC-I/S16K 制造商:Microchip Technology Inc 功能描述:512K I2C SMARTCARD EE DIE IN W - Gel-pak, waffle pack, wafer, diced wafer on film
24LC512SC-I/W16K 制造商:Microchip Technology Inc 功能描述:512K I2C SMARTCARD EE WAFER, IND - Gel-pak, waffle pack, wafer, diced wafer on film