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参数资料
| 型号： | 24LC512-I/SM |
| 厂商： | Microchip Technology |
| 文件页数： | 4/36页 |
| 文件大小： | 0K |
| 描述： | IC EEPROM 512KBIT 400KHZ 8SOIC |
| 产品培训模块： | I2C Serial EEPROM |
| 标准包装： | 90 |
| 格式 - 存储器： | EEPROMs - 串行 |
| 存储器类型： | EEPROM |
| 存储容量： | 512K (64K x 8) |
| 速度： | 400kHz |
| 接口： | I²C，2 线串口 |
| 电源电压： | 2.5 V ~ 5.5 V |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 8-SOIC（0.209"，5.30mm 宽） |
| 供应商设备封装： | 8-SOIJ |
| 包装： | 管件 |
| 产品目录页面： | 1447 (CN2011-ZH PDF) |
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24AA512/24LC512/24FC512
Electrical Characteristics:
AC CHARACTERISTICS (Continued)
Industrial (I): V CC = +1.7V to 5.5V
Automotive (E): V CC = +2.5V to 5.5V
T A = -40°C to +85°C
T A = -40°C to +125°C
Param.
No.
16
Sym.
T SP
Characteristic
Input filter spike suppression
Min.
—
Max.
50
Units
ns
Conditions
All except, 24FC512 (Notes 1 and 3)
(SDA and SCL pins)
17
18
T WC
—
Write cycle time (byte or page)
Endurance
—
1,000,000
5
—
ms
cycles
—
Page Mode, 25°C, V CC = 5.5V
(Note 4)
Note 1:
2:
3:
4:
Not 100% tested. C B = total capacitance of one bus line in pF.
As a transmitter, the device must provide an internal minimum delay time to bridge the undefined region (minimum
300 ns) of the falling edge of SCL to avoid unintended generation of Start or Stop conditions.
The combined T SP and V HYS specifications are due to new Schmitt Trigger inputs which provide improved noise spike
suppression. This eliminates the need for a T I specification for standard operation.
This parameter is not tested but ensured by characterization. For endurance estimates in a specific application, please
consult the Total Endurance? Model which can be obtained from Microchip’s web site at www.microchip.com.
DS21754M-page 4
? 2010 Microchip Technology Inc.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| 24LC512SC/S16K | 制造商:Microchip Technology Inc 功能描述:512K I2C SMARTCARD EE DIE IN WAFFLE PK - Gel-pak, waffle pack, wafer, diced wafer on film |
| 24LC512SC/W16K | 制造商:Microchip Technology Inc 功能描述:512K I2C SMARTCARD EE WAFER - Gel-pak, waffle pack, wafer, diced wafer on film |
| 24LC512SC/WF16K | 制造商:Microchip Technology Inc 功能描述:512K I2C SMARTCARD EE WAFER ON FRAME - Gel-pak, waffle pack, wafer, diced wafer on film |
| 24LC512SC-I/S16K | 制造商:Microchip Technology Inc 功能描述:512K I2C SMARTCARD EE DIE IN W - Gel-pak, waffle pack, wafer, diced wafer on film |
| 24LC512SC-I/W16K | 制造商:Microchip Technology Inc 功能描述:512K I2C SMARTCARD EE WAFER, IND - Gel-pak, waffle pack, wafer, diced wafer on film |
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