参数资料
型号: 24LC512-I/SN
厂商: Microchip Technology
文件页数: 12/36页
文件大小: 0K
描述: IC EEPROM 512KBIT 400KHZ 8SOIC
标准包装: 100
格式 - 存储器: EEPROMs - 串行
存储器类型: EEPROM
存储容量: 512K (64K x 8)
速度: 400kHz
接口: I²C,2 线串口
电源电压: 2.5 V ~ 5.5 V
工作温度: -40°C ~ 85°C
封装/外壳: 8-SOIC(0.154",3.90mm 宽)
供应商设备封装: 8-SOICN
包装: 管件
24AA512/24LC512/24FC512
7.0 ACKNOWLEDGE POLLING
Since the device will not acknowledge during a write
cycle, this can be used to determine when the cycle is
complete (this feature can be used to maximize bus
throughput). Once the Stop condition for a Write
command has been issued from the master, the device
initiates the internally timed write cycle. ACK polling
can be initiated immediately. This involves the master
sending a Start condition, followed by the control byte
for a Write command (R/W = 0 ). If the device is still
busy with the write cycle, then no ACK will be returned.
If no ACK is returned, then the Start bit and control byte
must be re-sent. If the cycle is complete, then the
device will return the ACK and the master can then
proceed with the next Read or Write command. See
FIGURE 7-1:
ACKNOWLEDGE POLLING
FLOW
Send
Write Command
Send Stop
Condition to
Initiate Write Cycle
Send Start
Figure 7-1 for flow diagram.
Send Control Byte
with R/W = 0
Did Device
Acknowledge
(ACK = 0 )?
Yes
Next
Operation
No
DS21754M-page 12
? 2010 Microchip Technology Inc.
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相关代理商/技术参数
参数描述
24LC512SC/S16K 制造商:Microchip Technology Inc 功能描述:512K I2C SMARTCARD EE DIE IN WAFFLE PK - Gel-pak, waffle pack, wafer, diced wafer on film
24LC512SC/W16K 制造商:Microchip Technology Inc 功能描述:512K I2C SMARTCARD EE WAFER - Gel-pak, waffle pack, wafer, diced wafer on film
24LC512SC/WF16K 制造商:Microchip Technology Inc 功能描述:512K I2C SMARTCARD EE WAFER ON FRAME - Gel-pak, waffle pack, wafer, diced wafer on film
24LC512SC-I/S16K 制造商:Microchip Technology Inc 功能描述:512K I2C SMARTCARD EE DIE IN W - Gel-pak, waffle pack, wafer, diced wafer on film
24LC512SC-I/W16K 制造商:Microchip Technology Inc 功能描述:512K I2C SMARTCARD EE WAFER, IND - Gel-pak, waffle pack, wafer, diced wafer on film