参数资料
型号: 450-0019
厂商: LS Research LLC
文件页数: 10/40页
文件大小: 0K
描述: MODULE SIFLEX02 RF CASTELLATION
标准包装: 50
系列: ModFlex™
频率: 915MHz
数据传输率 - 最大: 1Mbps
调制或协议: 802.15.4 Zigbee
应用: 通用
功率 - 输出: 250mW
灵敏度: -102dBm
电源电压: 2 V ~ 3.45 V
电流 - 接收: 30mA
电流 - 传输: 285mA
数据接口: 用于引脚的垫片
存储容量: 256kB 闪存,16kB SRAM
天线连接器: 堡形
工作温度: -40°C ~ 85°C
封装/外壳: 模块
包装: 托盘
SiFLEX02 TRANSCEIVER MODULE
DATASHEET
MODULE OVERVIEW
Figure 4 shows the internal interconnects of the ICs on the SiFLEX02 module. Consult the respective
IC datasheets for details, or contact LSR sales to purchase the SiFLEX02 module schematics as part of
LSR’s ModFLEX? design program. For a high-level block diagram of the SiFLEX02 module, see
Figure 1.
26
/RST
8
27
28
RX_START
IRQ
10
24
1
DIG3 (TX EN)
RF Power
Atmel
ATXMEGA256A3
29
30
31
32
SLP_TR
/SEL
MOSI
MISO
11
23
22
20
Atmel
AT86RF212
2
DIG4 (RX EN)
Amplifier
33
SCLK
19
Figure 4 SiFLEX02 Module Block Diagram – Internal Interconnects
Microcontroller
The XMEGA A3 is a family of low power, high performance and peripheral rich CMOS 8/16-bit
microcontrollers based on the AVR? enhanced RISC architecture. By executing powerful instructions
in a single clock cycle, the XMEGA A3 achieves throughputs approaching 1 Million Instructions Per
Second (MIPS), thus allowing the system designer to optimize power consumption versus processing
speed. Figure 5 shows a block diagram of the ATXMEGA256A3.
The information in this document is subject to change without notice.
330-0009-R3.1
Copyright ? 2009-2012 LS Research, LLC
Page 10 of 40
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