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参数资料
| 型号： | 450-0019 |
| 厂商： | LS Research LLC |
| 文件页数： | 5/40页 |
| 文件大小： | 0K |
| 描述： | MODULE SIFLEX02 RF CASTELLATION |
| 标准包装： | 50 |
| 系列： | ModFlex™ |
| 频率： | 915MHz |
| 数据传输率 - 最大： | 1Mbps |
| 调制或协议： | 802.15.4 Zigbee |
| 应用： | 通用 |
| 功率 - 输出： | 250mW |
| 灵敏度： | -102dBm |
| 电源电压： | 2 V ~ 3.45 V |
| 电流 - 接收： | 30mA |
| 电流 - 传输： | 285mA |
| 数据接口： | 用于引脚的垫片 |
| 存储容量： | 256kB 闪存，16kB SRAM |
| 天线连接器： | 堡形 |
| 工作温度： | -40°C ~ 85°C |
| 封装/外壳： | 模块 |
| 包装： | 托盘 |
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SiFLEX02 TRANSCEIVER MODULE
DATASHEET
Recommended Reflow Profile for Lead Free Solder ............................................................................. 22
CLEANING ......................................................................................................................... 23
OPTICAL INSPECTION ..................................................................................................... 23
REWORK ........................................................................................................................... 23
SHIPPING, HANDLING, AND STORAGE ......................................................................... 23
Shipping ..................................................................................................................................................... 23
Handling ..................................................................................................................................................... 23
Moisture Sensitivity Level (MSL) ............................................................................................................. 23
Storage ....................................................................................................................................................... 23
Repeating Reflow Soldering .................................................................................................................... 24
AGENCY STATEMENTS ................................................................................................... 25
ANTENNA INFORMATION ................................................................................................ 29
Wire Antenna (Perpendicular to Board as in Figure 16) ....................................................................... 29
Helical Antenna ......................................................................................................................................... 30
MECHANICAL DATA......................................................................................................... 31
PCB Footprint ............................................................................................................................................ 31
General Module Dimensions .................................................................................................................... 32
Module with Wire Antenna ....................................................................................................................... 33
Module with Helical Antenna ................................................................................................................... 34
COMPATIBILITY ................................................................................................................ 35
MODULE REVISION HISTORY ......................................................................................... 36
Rev 1.0 ........................................................................................................................................................ 36
Rev 1.1 ........................................................................................................................................................ 36
Rev 1.3 ........................................................................................................................................................ 37
Rev 2.0 ........................................................................................................................................................ 38
Rev 3.0 ........................................................................................................................................................ 39
CONTACTING LS RESEARCH ......................................................................................... 40
The information in this document is subject to change without notice.
330-0009-R3.1
Copyright ? 2009-2012 LS Research, LLC
Page 5 of 40
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相关代理商/技术参数 |
参数描述 |
|---|---|
| 45-0001-BR | 制造商:DATACOMM ELECTRONICS 功能描述:CABLE PASS THROUGH WALL PLATE RECESSED IN WALL BROWN |
| 45-0001-LA | 制造商:DATACOMM ELECTRONICS 功能描述:CABLE PASS THROUGH WALL PLATE RECESSED IN WALL LT ALMOND |
| 45-0001-WH | 制造商:DATACOMM ELECTRONICS 功能描述:CABLE PASS THROUGH WALL PLATE RECESSED IN WALL WHITE |
| 450002 | 制造商:n/a 功能描述:RELAY 240VAC 25AMPS INPUT 3-32VDC |
| 450-002 | 制造商:n/a 功能描述:RELAY 240VAC 25AMPS INPUT 3-32VDC |
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