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4
FN6305.3
November 15, 2006
Absolute Maximum Ratings
Thermal Information
Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . GND - 0.3V to 15V
BOOT Voltage, VBOOT . . . . . . . . . . . . . . . . . . . . GND - 0.3V to 36V
UGATE Voltage VUGATE . . . . . . . . VPHASE - 0.3V to VBOOT + 0.3V
LGATE/OCSET Voltage, VLGATE/OCSET GND - 0.3V to VCC + 0.3V
PHASE Voltage, VPHASE . . . . . . . . . .GND - 0.3V to VBOOT + 0.3V
Upper Driver Supply Voltage, VBOOT - VPHASE . . . . . . . . . . . . .15V
Clamp Voltage, VBOOT - VCC . . . . . . . . . . . . . . . . . . . . . . . . . . .24V
FB, COMP/SD Voltage. . . . . . . . . . . . . . . . . . . . . . GND - 0.3V to 6V
ESD Classification, HBM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.5kV
ESD Classification, MM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .150V
ESD Classification, CDM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0kV
Operating Conditions
Supply Voltage, VCC . . . . +5V ±10%, +12V ±20%, or 6.5V to 14.4V
Ambient Temperature Range
ISL6545C, ISL6545AC . . . . . . . . . . . . . . . . . . . . . . . 0°C to +70°C
ISL6545I, ISL6545AI . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C
Junction Temperature Range. . . . . . . . . . . . . . . . . .-40°C to +125°C
Thermal Resistance
θJA (°C/W) θJC (°C/W)
SOIC Package (Note 1) . . . . . . . . . . . .
95
N/A
DFN Package (Note 3). . . . . . . . . . . . .
44
5.5
Maximum Junction Temperature
(Plastic Package) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . -65°C to +150°C
Maximum Lead Temperature
(Soldering 10s) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +300°C
(SOIC - Lead Tips Only)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1.
θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
2.
θ
JA is measured with the component mounted on a high effective thermal conductivity test board in free air, with “direct attach” features. See
Tech Brief TB379 for details.
3. For
θJC, the “case temp” location is the center of the exposed metal pad on the package underside.
4. Guaranteed by design; not production tested
Electrical Specifications
Test Conditions: VCC = 12V, TJ = 0 to 85°C, Unless Otherwise Noted.
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNITS
VCC SUPPLY CURRENT
Input Bias Supply Current
IVCC
VCC = 12V; disabled
4
5.2
7
mA
POWER-ON RESET
Rising VCC POR Threshold
VPOR
3.9
4.1
4.3
V
VCC POR Threshold Hysteresis
0.30
0.35
0.40
V
OSCILLATOR
Switching Frequency
fOSC
ISL6545C
270
300
330
kHz
ISL6545I
240
300
330
kHz
fOSC
ISL6545AC
540
600
660
kHz
ISL6545AI
510
600
660
kHz
Ramp Amplitude (Note 4)
ΔVOSC
1.5
VP-P
REFERENCE
Reference Voltage Tolerance
ISL6545C
-1.0
-
+1.0
%
ISL6545I
-1.5
-
+1.5
%
Nominal Reference Voltage
VREF
0.600
V
ERROR AMPLIFIER
DC Gain (Note 4)
GAIN
-
96
-
dB
Gain-Bandwidth Product (Note 4)
GBWP
-
20
-
MHz
Slew Rate (Note 4)
SR
-
9
-
V/
μs
GATE DRIVERS
Upper Gate Source Impedance
RUG-SRCh VCC = 14.5V; I = 50mA
-
3.0
-
Ω
Upper Gate Sink Impedance
RUG-SNKh
VCC = 14.5V; I = 50mA
-
2.7
-
Ω
Lower Gate Source Impedance
RLG-SRCh
VCC = 14.5V; I = 50mA
-
2.4
-
Ω
ISL6545, ISL6545A